Software Defined Chips, Liu

Автор: Elfadel Ibrahim (Abe) M., Fettweis Gerhard
Название: 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
ISBN: 3319793055 ISBN-13(EAN): 9783319793054
Издательство: Springer
Рейтинг:
Цена: 46570.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.

Автор: Bernd H?fflinger
Название: CHIPS 2020 VOL. 2
ISBN: 3319220926 ISBN-13(EAN): 9783319220925
Издательство: Springer
Рейтинг:
Цена: 46570.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore`s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance.

Автор: Wei
Название: Software Defined Chips
ISBN: 9811969965 ISBN-13(EAN): 9789811969966
Издательство: Springer
Рейтинг:
Цена: 139750.00 T
Наличие на складе: Нет в наличии.
Описание: This is the first book of a two-volume book set which introduces software defined chips. In this book, it introduces the conceptual evolution of software defined chips from the development of integrated circuits and computing architectures. Technical principles, characteristics and key issues of software defined chips are systematically analyzed. The hardware architecture design methods are described involving architecture design primitives, hardware design spaces and agile design methods. From the perspective of the compilation system, the complete process from high-level language to configuration contexts is introduced in detail. This book is suitable for scientists and researchers in the areas of electrical and electronic engineering and computer science. Postgraduate students, practitioners and professionals in related areas are also potentially interested in the topic of this book.

Автор: Liu
Название: Software Defined Chips
ISBN: 981197635X ISBN-13(EAN): 9789811976353
Издательство: Springer
Рейтинг:
Цена: 149060.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book is the second volume of a two-volume book set which introduces software-defined chips. In this book, the programming model of the software-defined chips is analyzed by tracing the coevolution of modern general-purpose processors and programming models. The enhancement in hardware security and reliability of the software-defined chips are described from the perspective of dynamic and partial reconfiguration. The challenges and prospective trends of software-defined chips are also discussed. Current applications in the fields of artificial intelligence, cryptography, 5G communications, etc., are presented in detail. Potential applications in the future, including post-quantum cryptography, evolutionary computing, etc., are also discussed. This book is suitable for scientists and researchers in the areas of electrical and electronic engineering and computer science. Postgraduate students, practitioners and professionals in related areas are also potentially interested in the topic of this book.

Автор: Wei
Название: Software Defined Chips
ISBN: 9811969930 ISBN-13(EAN): 9789811969935
Издательство: Springer
Рейтинг:
Цена: 139750.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This is the first book of a two-volume book set which introduces software defined chips. In this book, it introduces the conceptual evolution of software defined chips from the development of integrated circuits and computing architectures. Technical principles, characteristics and key issues of software defined chips are systematically analyzed. The hardware architecture design methods are described involving architecture design primitives, hardware design spaces and agile design methods. From the perspective of the compilation system, the complete process from high-level language to configuration contexts is introduced in detail. This book is suitable for scientists and researchers in the areas of electrical and electronic engineering and computer science. Postgraduate students, practitioners and professionals in related areas are also potentially interested in the topic of this book.

Автор: Murmann Boris, Hoefflinger Bernd
Название: Nano-Chips 2030: On-Chip AI for an Efficient Data-Driven World
ISBN: 3030183378 ISBN-13(EAN): 9783030183370
Издательство: Springer
Рейтинг:
Цена: 121110.00 T
Наличие на складе: Нет в наличии.
Описание: In this book, a world-wide team of experts from academia, research institutes, and industry presents how intelligent nano-chip systems can enable autonomous mobility, care robotics, wearable and implanted health-support, as well as other cooperative man-machine systems that will define our needs toward 2030 and beyond.

Название: 3d stacked chips
ISBN: 3319204807 ISBN-13(EAN): 9783319204802
Издательство: Springer
Рейтинг:
Цена: 113190.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.

Автор: Srinivasan Murali
Название: Designing Reliable and Efficient Networks on Chips
ISBN: 904818200X ISBN-13(EAN): 9789048182008
Издательство: Springer
Рейтинг:
Цена: 130590.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The book provides state-of-the-art methods to solve some of the most important problems encountered during NoC design. It is the first book to present in depth the state-of-the-art algorithms and optimization models for performing system-level design of NoCs.

Автор: Veendrick
Название: Bits on Chips
ISBN: 3319760955 ISBN-13(EAN): 9783319760957
Издательство: Springer
Рейтинг:
Цена: 46570.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides readers with a broad overview of integrated circuits, also generally referred to as micro-electronics. The presentation is designed to be accessible to readers with limited, technical knowledge and coverage includes key aspects of integrated circuit design, implementation, fabrication and application.

Автор: Platt Charles
Название: Encyclopedia of Electronic Components Volume 2: Diodes, Transistors, Chips, Light, Heat, and Sound Emitters
ISBN: 1449334180 ISBN-13(EAN): 9781449334185
Издательство: Wiley
Рейтинг:
Цена: 25330.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Want to know how to use an electronic component? This second book of a three-volume set includes key information on electronics parts for your projects - complete with photographs, schematics, and diagrams. You`ll learn what each one does, how it works, why it`s useful, and what variants exist.

Автор: Platt Charles
Название: Make: More Electronics: Learning Through Discovery
ISBN: 1449344046 ISBN-13(EAN): 9781449344047
Издательство: Wiley
Рейтинг:
Цена: 29560.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: If you finished the projects in Make: Electronics, or if you`re already familiar with the material in that book, you`re ready for Make: More Electronics. Right away, you`ll start working on real projects, and you`ll explore all the key components and essential principles through the book`s collection of experiments.

Автор: Wu
Название: Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology
ISBN: 981991454X ISBN-13(EAN): 9789819914548
Издательство: Springer
Рейтинг:
Цена: 130430.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases. Coherent processes of basic theories and design implementations of microwave and millimeter-wave chips are presented in detail. It forms a complete system from design theory, circuit simulation, full-wave electromagnetic simulation, and fabrication to measurement. Five representative microwave and millimeter-wave passive chips based on TFIPD technology are taken as examples to demonstrate the complete process from theory, design, simulation, fabrication, and measurement, which is comprehensive, systematical, and easy to learn and understand, convenient to operate, and close to the practical application. This book is mainly aimed at the design and simulation of microwave and millimeter-wave chips based on thin-film integrated passive device technology. On the basis of specific cases, it introduces the whole process from theory, design, simulation, optimization, fabrication to measurement of the balanced filter, microstrip filter, absorptive filter, power divider, and balun. This book is suitable for the professional technicians who are engaged in the design and engineering application of microwave and millimeter-wave device chips. It can also be used as the textbook of electronic science and technology, electromagnetic field and microwave technology, electronic engineering, radar engineering, integrated circuit, and other related majors in colleges and universities.