Nano-Chips 2030: On-Chip AI for an Efficient Data-Driven World, Murmann Boris, Hoefflinger Bernd

Автор: Murmann Boris, Hoefflinger Bernd
Название: Nano-Chips 2030: On-Chip AI for an Efficient Data-Driven World
ISBN: 3030183408 ISBN-13(EAN): 9783030183400
Издательство: Springer
Цена: 121110.00 T
Наличие на складе: Нет в наличии.
Описание: In this book, a global team of experts from academia, research institutes and industry presents their vision on how new nano-chip architectures will enable the performance and energy efficiency needed for AI-driven advancements in autonomous mobility, healthcare, and man-machine cooperation.

Автор: Srinivasan Murali
Название: Designing Reliable and Efficient Networks on Chips
ISBN: 904818200X ISBN-13(EAN): 9789048182008
Издательство: Springer
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Цена: 130590.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The book provides state-of-the-art methods to solve some of the most important problems encountered during NoC design. It is the first book to present in depth the state-of-the-art algorithms and optimization models for performing system-level design of NoCs.

Автор: Bernd Hoefflinger
Название: Chips 2020
ISBN: 3662506459 ISBN-13(EAN): 9783662506455
Издательство: Springer
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Цена: 78350.00 T
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Описание: Chips 2020 presents a new, sustainable roadmap towards femto(10-15)-Joule low-energy, high-performance electronics. The text focuses on the energy-efficiency of all chip functionalities, sensing, processing, and communication.

Автор: C. Toumazou; Jos? M. de la Rosa; Bel?n P?rez-Verd?
Название: Systematic Design of CMOS Switched-Current Bandpass Sigma-Delta Modulators for Digital Communication Chips
ISBN: 144194950X ISBN-13(EAN): 9781441949509
Издательство: Springer
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Цена: 174130.00 T
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Описание: This very detailed book discusses architectures, circuits and procedures for the optimum design of bandpass sigma-delta A/D interfaces for mixed-signal chips in standard CMOS technologies. It provides uniquely in-depth coverage of switched-current errors, which supports the design of high performance SI chips.

Автор: Harry Veendrick
Название: Bits on Chips
ISBN: 3030094014 ISBN-13(EAN): 9783030094010
Издательство: Springer
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Цена: 46570.00 T
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Описание: This book provides readers with a broad overview of integrated circuits, also generally referred to as micro-electronics. The presentation is designed to be accessible to readers with limited, technical knowledge and coverage includes key aspects of integrated circuit design, implementation, fabrication and application. The author complements his discussion with a large number of diagrams and photographs, in order to reinforce the explanations. The book is divided into two parts, the first of which is specifically developed for people with almost no or little technical knowledge. It presents an overview of the electronic evolution and discusses the similarity between a chip floor plan and a city plan, using metaphors to help explain concepts. It includes a summary of the chip development cycle, some basic definitions and a variety of applications that use integrated circuits. The second part digs deeper into the details and is perfectly suited for professionals working in one of the semiconductor disciplines who want to broaden their semiconductor horizon.

Автор: Wei
Название: Software Defined Chips
ISBN: 9811969930 ISBN-13(EAN): 9789811969935
Издательство: Springer
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Цена: 139750.00 T
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Описание: This is the first book of a two-volume book set which introduces software defined chips. In this book, it introduces the conceptual evolution of software defined chips from the development of integrated circuits and computing architectures. Technical principles, characteristics and key issues of software defined chips are systematically analyzed. The hardware architecture design methods are described involving architecture design primitives, hardware design spaces and agile design methods. From the perspective of the compilation system, the complete process from high-level language to configuration contexts is introduced in detail. This book is suitable for scientists and researchers in the areas of electrical and electronic engineering and computer science. Postgraduate students, practitioners and professionals in related areas are also potentially interested in the topic of this book.

Автор: Bernd H?fflinger
Название: CHIPS 2020 VOL. 2
ISBN: 3319366092 ISBN-13(EAN): 9783319366098
Издательство: Springer
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Цена: 65290.00 T
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Описание: The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore`s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance.

Автор: Andr?s Vajda
Название: Programming Many-Core Chips
ISBN: 1489991697 ISBN-13(EAN): 9781489991690
Издательство: Springer
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Цена: 104480.00 T
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Описание: This book presents new concepts, techniques and promising programming models for designing software for chips with "many" (hundreds to thousands) processor cores. It serves as a single-source reference to the state-of-the-art in programming many-core chips.

Автор: Bernd H?fflinger
Название: CHIPS 2020 VOL. 2
ISBN: 3319220926 ISBN-13(EAN): 9783319220925
Издательство: Springer
Рейтинг:
Цена: 46570.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore`s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance.

Автор: Platt Charles
Название: Make: More Electronics: Learning Through Discovery
ISBN: 1449344046 ISBN-13(EAN): 9781449344047
Издательство: Wiley
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Цена: 29560.00 T
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Описание: If you finished the projects in Make: Electronics, or if you`re already familiar with the material in that book, you`re ready for Make: More Electronics. Right away, you`ll start working on real projects, and you`ll explore all the key components and essential principles through the book`s collection of experiments.

Название: 3d stacked chips
ISBN: 3319204807 ISBN-13(EAN): 9783319204802
Издательство: Springer
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Цена: 113190.00 T
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Описание: This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.

Автор: Wu
Название: Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology
ISBN: 981991454X ISBN-13(EAN): 9789819914548
Издательство: Springer
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Цена: 130430.00 T
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Описание: This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases. Coherent processes of basic theories and design implementations of microwave and millimeter-wave chips are presented in detail. It forms a complete system from design theory, circuit simulation, full-wave electromagnetic simulation, and fabrication to measurement. Five representative microwave and millimeter-wave passive chips based on TFIPD technology are taken as examples to demonstrate the complete process from theory, design, simulation, fabrication, and measurement, which is comprehensive, systematical, and easy to learn and understand, convenient to operate, and close to the practical application. This book is mainly aimed at the design and simulation of microwave and millimeter-wave chips based on thin-film integrated passive device technology. On the basis of specific cases, it introduces the whole process from theory, design, simulation, optimization, fabrication to measurement of the balanced filter, microstrip filter, absorptive filter, power divider, and balun. This book is suitable for the professional technicians who are engaged in the design and engineering application of microwave and millimeter-wave device chips. It can also be used as the textbook of electronic science and technology, electromagnetic field and microwave technology, electronic engineering, radar engineering, integrated circuit, and other related majors in colleges and universities.