3D Stacked Chips: From Emerging Processes to Heterogeneous Systems, Elfadel Ibrahim (Abe) M., Fettweis Gerhard

Название: 3d stacked chips
ISBN: 3319204807 ISBN-13(EAN): 9783319204802
Издательство: Springer
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Цена: 113190.00 T
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Описание: This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.

Автор: ?kos Zar?ndy
Название: Focal-Plane Sensor-Processor Chips
ISBN: 1489994688 ISBN-13(EAN): 9781489994684
Издательство: Springer
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Цена: 121890.00 T
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Описание: Focal-Plane Sensor-Processor Chips explores both the implementation and application of state-of-the-art vision chips. Presenting an overview of focal plane chip technology, the text discusses smart imagers and cellular wave computers, along with numerous examples of current vision chips.

Автор: C. Toumazou; Jos? M. de la Rosa; Bel?n P?rez-Verd?
Название: Systematic Design of CMOS Switched-Current Bandpass Sigma-Delta Modulators for Digital Communication Chips
ISBN: 144194950X ISBN-13(EAN): 9781441949509
Издательство: Springer
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Цена: 174130.00 T
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Описание: This very detailed book discusses architectures, circuits and procedures for the optimum design of bandpass sigma-delta A/D interfaces for mixed-signal chips in standard CMOS technologies. It provides uniquely in-depth coverage of switched-current errors, which supports the design of high performance SI chips.

Автор: Bernd H?fflinger
Название: CHIPS 2020 VOL. 2
ISBN: 3319220926 ISBN-13(EAN): 9783319220925
Издательство: Springer
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Цена: 46570.00 T
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Описание: The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore`s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance.

Автор: Veendrick
Название: Bits on Chips
ISBN: 3319760955 ISBN-13(EAN): 9783319760957
Издательство: Springer
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Цена: 46570.00 T
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Описание: This book provides readers with a broad overview of integrated circuits, also generally referred to as micro-electronics. The presentation is designed to be accessible to readers with limited, technical knowledge and coverage includes key aspects of integrated circuit design, implementation, fabrication and application.

Автор: Harry Veendrick
Название: Bits on Chips
ISBN: 3030094014 ISBN-13(EAN): 9783030094010
Издательство: Springer
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Цена: 46570.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides readers with a broad overview of integrated circuits, also generally referred to as micro-electronics. The presentation is designed to be accessible to readers with limited, technical knowledge and coverage includes key aspects of integrated circuit design, implementation, fabrication and application. The author complements his discussion with a large number of diagrams and photographs, in order to reinforce the explanations. The book is divided into two parts, the first of which is specifically developed for people with almost no or little technical knowledge. It presents an overview of the electronic evolution and discusses the similarity between a chip floor plan and a city plan, using metaphors to help explain concepts. It includes a summary of the chip development cycle, some basic definitions and a variety of applications that use integrated circuits. The second part digs deeper into the details and is perfectly suited for professionals working in one of the semiconductor disciplines who want to broaden their semiconductor horizon.

Автор: Gustavo Neuberger; Gilson Wirth; Ricardo Reis
Название: Protecting Chips Against Hold Time Violations Due to Variability
ISBN: 9401777942 ISBN-13(EAN): 9789401777940
Издательство: Springer
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Цена: 95770.00 T
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Описание: Novel `very deep sub-micron` technologies in digital circuit manufacture have raised the profile of process variability as an issue. This volume focuses on storage elements and examines the consequences of variability in several aspects of circuit design.

Автор: Srinivasan Murali
Название: Designing Reliable and Efficient Networks on Chips
ISBN: 904818200X ISBN-13(EAN): 9789048182008
Издательство: Springer
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Цена: 130590.00 T
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Описание: The book provides state-of-the-art methods to solve some of the most important problems encountered during NoC design. It is the first book to present in depth the state-of-the-art algorithms and optimization models for performing system-level design of NoCs.

Автор: Bernd H?fflinger
Название: CHIPS 2020 VOL. 2
ISBN: 3319366092 ISBN-13(EAN): 9783319366098
Издательство: Springer
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Цена: 65290.00 T
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Описание: The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore`s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance.

Автор: Garcia-robledo, Alberto (center For Research And Advanced Studies Of The National Polytechnic Institute (cinvestav-tamaulipas) Mexico)
Название: Creativity in load-balance schemes for multi/many-core heterogeneous graph computing: emerging research and opportunities
ISBN: 1522537996 ISBN-13(EAN): 9781522537991
Издательство: Mare Nostrum (Eurospan)
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Цена: 150610.00 T
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Описание: Recent years have witnessed the rise of analysis of real-world massive and complex phenomena in graphs; to efficiently solve these large-scale graph problems, it is necessary to exploit high performance computing (HPC), which accelerates the innovation process for discovery and invention of new products and procedures in network science. Creativity in Load-Balance Schemes for Multi/Many-Core Heterogeneous Graph Computing: Emerging Research and Opportunities is a critical scholarly resource that examines trends, challenges, and collaborative processes in emerging fields within complex network analysis. Featuring coverage on a broad range of topics such as high-performance computing, big data, network science, and accelerated network traversal, this book is geared towards data analysts, researchers, students in information communication technology (ICT), program developers, and academics.

Автор: Brandon Noia; Krishnendu Chakrabarty
Название: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
ISBN: 3319023772 ISBN-13(EAN): 9783319023779
Издательство: Springer
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Цена: 113190.00 T
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Описание: This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.