Silicon Nitride for Microelectronic Applications, J. T. Milek

Автор: Liu
Название: Modeling and Simulation for Microelectronic Packaging Assembly - Manufacturing, Reliability and Testing
ISBN: 0470827807 ISBN-13(EAN): 9780470827802
Издательство: Wiley
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Цена: 116110.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

Автор: Ephraim Suhir
Название: Structural Analysis in Microelectronic and Fiber-Optic Systems
ISBN: 9401165378 ISBN-13(EAN): 9789401165372
Издательство: Springer
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Цена: 46570.00 T
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Описание: This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in high technology engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc- tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc- tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi- ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.

Автор: John T. Milek
Название: Silicon Nitride for Microelectronic Applications
ISBN: 1468461648 ISBN-13(EAN): 9781468461640
Издательство: Springer
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Цена: 95770.00 T
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Описание: 2 References 4 Methods of Preparation * 5 Introduction * 5 Direct Nitridation Method 8 Evaporation Method * 9 Glow Discharge Method.

Автор: G.G. Harman; Pavel Mach
Название: Microelectronic Interconnections and Assembly
ISBN: 9401061599 ISBN-13(EAN): 9789401061599
Издательство: Springer
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Цена: 81050.00 T
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Описание: Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996

Автор: J?rg Schwizer; Michael Mayer; Oliver Brand
Название: Force Sensors for Microelectronic Packaging Applications
ISBN: 3642060633 ISBN-13(EAN): 9783642060632
Издательство: Springer
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Цена: 139750.00 T
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Описание: Sensor Design.- Measurement System.- Characterization.- Applications.- Conclusions and Outlook.

Автор: Yannis E. Papananos
Название: Radio-Frequency Microelectronic Circuits for Telecommunication Applications
ISBN: 0792386418 ISBN-13(EAN): 9780792386414
Издательство: Springer
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Цена: 139310.00 T
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Описание: Radio-Frequency Microelectronic Circuits for Telecommunication Applications covers the design issues of radio-frequency microelectronic circuits for telecommunication applications with emphasis on devices and circuit-level design.

Автор: R.A. Levy
Название: Microelectronic Materials and Processes
ISBN: 0792301544 ISBN-13(EAN): 9780792301547
Издательство: Springer
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Цена: 325160.00 T
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Описание: Proceedings of the NATO Advanced Study Institute, Il Ciocco, Castelvecchio Pascoli, Italy, June 30-July 11, 1986

Автор: Yannis E. Papananos
Название: Radio-Frequency Microelectronic Circuits for Telecommunication Applications
ISBN: 1441951040 ISBN-13(EAN): 9781441951045
Издательство: Springer
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Цена: 113180.00 T
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Описание: Radio-Frequency Microelectronic Circuits for Telecommunication Applications covers the design issues of radio-frequency microelectronic circuits for telecommunication applications with emphasis on devices and circuit-level design.

Автор: Maurizio Di Paolo Emilio
Название: Microelectronic Circuit Design for Energy Harvesting Systems
ISBN: 331947586X ISBN-13(EAN): 9783319475868
Издательство: Springer
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Цена: 111790.00 T
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Описание: This book describes the design of microelectronic circuits for energy harvesting, broadband energy conversion, new methods and technologies for energy conversion. The author also discusses the design of power management circuits and the implementation of voltage regulators. Coverage includes advanced methods in low and high power electronics, as well as principles of micro-scale design based on piezoelectric, electromagnetic and thermoelectric technologies with control and conditioning circuit design.

Автор: Albert Heuberger; G?nter Elst; Randolf Hanke; Jani
Название: Microelectronic Systems
ISBN: 3642430090 ISBN-13(EAN): 9783642430091
Издательство: Springer
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Цена: 130430.00 T
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Автор: A. H. Agajanian
Название: Microelectronic Packaging
ISBN: 1468461079 ISBN-13(EAN): 9781468461077
Издательство: Springer
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Цена: 93160.00 T
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Описание: Microelectronic packaging protects and supports electronic devices and circuits and provides connections to the other parts of the system. Hybrid microelectronic circuits and subsystem packages support the substrates; This book is a comprehensive bibliography of over 3000 refer- ences of the world literature in microelectronic packaging.