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Structural Analysis in Microelectronic and Fiber-Optic Systems, Ephraim Suhir


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Автор: Ephraim Suhir
Название:  Structural Analysis in Microelectronic and Fiber-Optic Systems
ISBN: 9789401165372
Издательство: Springer
Классификация:

ISBN-10: 9401165378
Обложка/Формат: Paperback
Страницы: 418
Вес: 0.58 кг.
Дата издания: 17.02.2012
Язык: English
Размер: 229 x 152 x 23
Основная тема: Science, Humanities and Social Sciences, multidisciplinary
Подзаголовок: Volume I Basic Principles of Engineering Elastictiy and Fundamentals of Structural Analysis
Ссылка на Издательство: Link
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Поставляется из: Германии
Описание: This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in high technology engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc- tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc- tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi- ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.

Microelectronic Circuit Design for Energy Harvesting Systems

Автор: Maurizio Di Paolo Emilio
Название: Microelectronic Circuit Design for Energy Harvesting Systems
ISBN: 331947586X ISBN-13(EAN): 9783319475868
Издательство: Springer
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Цена: 111790.00 T
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Описание: This book describes the design of microelectronic circuits for energy harvesting, broadband energy conversion, new methods and technologies for energy conversion. The author also discusses the design of power management circuits and the implementation of voltage regulators. Coverage includes advanced methods in low and high power electronics, as well as principles of micro-scale design based on piezoelectric, electromagnetic and thermoelectric technologies with control and conditioning circuit design.

Microelectronics Circuit Analysis and Design

Автор: Neamen Donald A
Название: Microelectronics Circuit Analysis and Design
ISBN: 007128947X ISBN-13(EAN): 9780071289474
Издательство: McGraw-Hill
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Цена: 65190.00 T
Наличие на складе: Невозможна поставка.
Описание: Microelectronics Circuit Analysis and Design is intended as a core text in electronics for undergraduate electrical and computer engineering students. The fourth edition continues to provide a foundation for analyzing and designing both analog and digital electronic circuits. The goal has always been to make this book very readable and student friendly.

Microelectronic Systems

Автор: Albert Heuberger; G?nter Elst; Randolf Hanke; Jani
Название: Microelectronic Systems
ISBN: 3642430090 ISBN-13(EAN): 9783642430091
Издательство: Springer
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Цена: 130430.00 T
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Force Sensors for Microelectronic Packaging Applications

Автор: J?rg Schwizer; Michael Mayer; Oliver Brand
Название: Force Sensors for Microelectronic Packaging Applications
ISBN: 3642060633 ISBN-13(EAN): 9783642060632
Издательство: Springer
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Цена: 139750.00 T
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Описание: Sensor Design.- Measurement System.- Characterization.- Applications.- Conclusions and Outlook.

Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research

Автор: Iyengar Madhusudan Et Al
Название: Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research
ISBN: 9814579785 ISBN-13(EAN): 9789814579780
Издательство: World Scientific Publishing
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Цена: 158400.00 T
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Описание:

To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.

This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.


Radio-Frequency Microelectronic Circuits for Telecommunication Applications

Автор: Yannis E. Papananos
Название: Radio-Frequency Microelectronic Circuits for Telecommunication Applications
ISBN: 1441951040 ISBN-13(EAN): 9781441951045
Издательство: Springer
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Цена: 113180.00 T
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Описание: Radio-Frequency Microelectronic Circuits for Telecommunication Applications covers the design issues of radio-frequency microelectronic circuits for telecommunication applications with emphasis on devices and circuit-level design.

Microelectronic Materials and Processes

Автор: R.A. Levy
Название: Microelectronic Materials and Processes
ISBN: 0792301471 ISBN-13(EAN): 9780792301479
Издательство: Springer
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Цена: 491940.00 T
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Описание: Proceedings of the NATO Advanced Study Institute, Il Ciocco, Castelvecchio Pascoli, Italy, June 30-July 11, 1986

Modeling and Simulation for Microelectronic Packaging Assembly - Manufacturing, Reliability and Testing

Автор: Liu
Название: Modeling and Simulation for Microelectronic Packaging Assembly - Manufacturing, Reliability and Testing
ISBN: 0470827807 ISBN-13(EAN): 9780470827802
Издательство: Wiley
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Цена: 116110.00 T
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Описание: An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

Silicon Nitride for Microelectronic Applications

Автор: J. T. Milek
Название: Silicon Nitride for Microelectronic Applications
ISBN: 1461596114 ISBN-13(EAN): 9781461596110
Издательство: Springer
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Цена: 46570.00 T
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Описание: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Diffusion Mask Applications . . . . . . . . . . . . `" 11 Glass-to-Metal Seals . 23 Passivation Applications . 24 Isolation . 76 Radiation Hardening Applications .


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