Microelectronic Circuit Design for Energy Harvesting Systems, Maurizio Di Paolo Emilio

Автор: Neamen Donald A
Название: Microelectronics Circuit Analysis and Design
ISBN: 007128947X ISBN-13(EAN): 9780071289474
Издательство: McGraw-Hill
Рейтинг:
Цена: 65190.00 T
Наличие на складе: Невозможна поставка.
Описание: Microelectronics Circuit Analysis and Design is intended as a core text in electronics for undergraduate electrical and computer engineering students. The fourth edition continues to provide a foundation for analyzing and designing both analog and digital electronic circuits. The goal has always been to make this book very readable and student friendly.

Автор: Iyengar Madhusudan Et Al
Название: Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research
ISBN: 9814579785 ISBN-13(EAN): 9789814579780
Издательство: World Scientific Publishing
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Цена: 158400.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание:

To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.

This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

Автор: Liu
Название: Modeling and Simulation for Microelectronic Packaging Assembly - Manufacturing, Reliability and Testing
ISBN: 0470827807 ISBN-13(EAN): 9780470827802
Издательство: Wiley
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Цена: 116110.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.