RF and Microwave Microelectronics Packaging II, Ken Kuang; Rick Sturdivant

Автор: Neamen Donald A
Название: Microelectronics Circuit Analysis and Design
ISBN: 007128947X ISBN-13(EAN): 9780071289474
Издательство: McGraw-Hill
Рейтинг:
Цена: 65190.00 T
Наличие на складе: Невозможна поставка.
Описание: Microelectronics Circuit Analysis and Design is intended as a core text in electronics for undergraduate electrical and computer engineering students. The fourth edition continues to provide a foundation for analyzing and designing both analog and digital electronic circuits. The goal has always been to make this book very readable and student friendly.

Автор: R.R. Tummala; Eugene J. Rymaszewski; Alan G. Klopf
Название: Microelectronics Packaging Handbook
ISBN: 0412084511 ISBN-13(EAN): 9780412084515
Издательство: Springer
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Цена: 181670.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Provides information on microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This three volume set discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry.

Автор: R.R. Tummala; Eugene J. Rymaszewski; Alan G. Klopf
Название: Microelectronics Packaging Handbook
ISBN: 0412084414 ISBN-13(EAN): 9780412084416
Издательство: Springer
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Цена: 279500.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies.

Автор: John Lau
Название: Thermal Stress and Strain in Microelectronics Packaging
ISBN: 1468477692 ISBN-13(EAN): 9781468477696
Издательство: Springer
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Цена: 113190.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications.

Автор: R.R. Tummala; Eugene J. Rymaszewski; Alan G. Klopf
Название: Microelectronics Packaging Handbook
ISBN: 1461368294 ISBN-13(EAN): 9781461368298
Издательство: Springer
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Цена: 243800.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Electronics has become the largest industry, surpassing agriCUlture, auto. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Автор: Ken Kuang; Franklin Kim; Sean S. Cahill
Название: RF and Microwave Microelectronics Packaging
ISBN: 1489983244 ISBN-13(EAN): 9781489983244
Издательство: Springer
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Цена: 121890.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.

Автор: Maurizio Di Paolo Emilio
Название: Microelectronics
ISBN: 3319364235 ISBN-13(EAN): 9783319364230
Издательство: Springer
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Цена: 78350.00 T
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Описание: Introduction.- P-spice simulation.- Solid state Physics.- Diode and circuits.- Bipolar transistor.- MOS transistor.- Operational amplifier.- Amplifiers.- Frequency response.- High frequency circuits.- Digital circuits: logic gates.- Combinatorial circuits.- Sequential circuits.- Logic families.- Memories and applications.- PCB design.- Routing PCB.- Design flow of PCB.- Conclusion.

Автор: Alexander A. Ignatiev; Alexander V. Lyashenko
Название: Heteromagnetic Microelectronics
ISBN: 1489989722 ISBN-13(EAN): 9781489989727
Издательство: Springer
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Цена: 156720.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Devoted to heteromagnetic microelectronics, this book is based on original material from the author`s programs of designing heteromagnetic microsystems of various types. It includes pioneering results of research on magnetoelectronics of millimetric waves.

Автор: J. Greer
Название: Nano and Giga Challenges in Microelectronics,
ISBN: 0444514945 ISBN-13(EAN): 9780444514943
Издательство: Elsevier Science
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Цена: 112290.00 T
Наличие на складе: Поставка под заказ.
Описание: Gives an introduction for engineers and researchers wishing to obtain a fundamental knowledge of the edge in technology research. This book also acts as an essential reference for the "gurus" wishing to keep abreast of the directions and challenges in microelectronic technology development and future trends.