Microelectronics Packaging Handbook, R.R. Tummala; Eugene J. Rymaszewski; Alan G. Klopf

Автор: Neamen Donald A
Название: Microelectronics Circuit Analysis and Design
ISBN: 007128947X ISBN-13(EAN): 9780071289474
Издательство: McGraw-Hill
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Цена: 65190.00 T
Наличие на складе: Невозможна поставка.
Описание: Microelectronics Circuit Analysis and Design is intended as a core text in electronics for undergraduate electrical and computer engineering students. The fourth edition continues to provide a foundation for analyzing and designing both analog and digital electronic circuits. The goal has always been to make this book very readable and student friendly.

Автор: Serge Luryi
Название: Future Trends in Microelectronics: The Nano Millennium
ISBN: 0471212474 ISBN-13(EAN): 9780471212478
Издательство: Wiley
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Цена: 102560.00 T
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Описание: Nanotechnology has been named by the US government as one of the most important areas of forthcoming technology. This book presents contributions from a number of leading professionals in the semiconductor microelectronics industry debating the future evolution of their profession.

Автор: J. Greer
Название: Nano and Giga Challenges in Microelectronics,
ISBN: 0444514945 ISBN-13(EAN): 9780444514943
Издательство: Elsevier Science
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Цена: 112290.00 T
Наличие на складе: Поставка под заказ.
Описание: Gives an introduction for engineers and researchers wishing to obtain a fundamental knowledge of the edge in technology research. This book also acts as an essential reference for the "gurus" wishing to keep abreast of the directions and challenges in microelectronic technology development and future trends.

Автор: John Lau
Название: Thermal Stress and Strain in Microelectronics Packaging
ISBN: 1468477692 ISBN-13(EAN): 9781468477696
Издательство: Springer
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Цена: 113190.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications.