Thermal Stress and Strain in Microelectronics Packaging, John Lau

Автор: Maurizio Di Paolo Emilio
Название: Microelectronics
ISBN: 3319225448 ISBN-13(EAN): 9783319225449
Издательство: Springer
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Цена: 95770.00 T
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Описание: Introduction.- P-spice simulation.- Solid state Physics.- Diode and circuits.- Bipolar transistor.- MOS transistor.- Operational amplifier.- Amplifiers.- Frequency response.- High frequency circuits.- Digital circuits: logic gates.- Combinatorial circuits.- Sequential circuits.- Logic families.- Memories and applications.- PCB design.- Routing PCB.- Design flow of PCB.- Conclusion.

Автор: Neamen Donald A
Название: Microelectronics Circuit Analysis and Design
ISBN: 007128947X ISBN-13(EAN): 9780071289474
Издательство: McGraw-Hill
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Цена: 65190.00 T
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Описание: Microelectronics Circuit Analysis and Design is intended as a core text in electronics for undergraduate electrical and computer engineering students. The fourth edition continues to provide a foundation for analyzing and designing both analog and digital electronic circuits. The goal has always been to make this book very readable and student friendly.

Автор: R.R. Tummala; Eugene J. Rymaszewski; Alan G. Klopf
Название: Microelectronics Packaging Handbook
ISBN: 1461368294 ISBN-13(EAN): 9781461368298
Издательство: Springer
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Цена: 243800.00 T
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Описание: Electronics has become the largest industry, surpassing agriCUlture, auto. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Автор: Suresh Chandra Satapathy; N Bheema Rao; S Srinivas
Название: Microelectronics, Electromagnetics and Telecommunications
ISBN: 8132227263 ISBN-13(EAN): 9788132227267
Издательство: Springer
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Цена: 287330.00 T
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Описание: This volume contains 73 papers presented at ICMEET 2015:International Conference on Microelectronics, Electromagnetics andTelecommunications. The conference was held during 18 - 19 December, 2015 atDepartment of Electronics and Communication Engineering, GITAM Institute ofTechnology, GITAM University, Visakhapatnam, INDIA.