Principles of Wood Science and Technology, Franz F.P. Kollmann; Franz Kollmann; Wilfred A.Jr.

Автор: Franz F.P. Kollmann; E.W. Kuenzi; A.J. Stamm
Название: Principles of Wood Science and Technology
ISBN: 3642879330 ISBN-13(EAN): 9783642879333
Издательство: Springer
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Цена: 130430.00 T
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Автор: Lawrence O. Copeland; Miller F. McDonald
Название: Principles of Seed Science and Technology
ISBN: 1461357195 ISBN-13(EAN): 9781461357193
Издательство: Springer
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Цена: 174150.00 T
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Описание: This Third Edition of Principles of Seed Science and Technology. A new chapter on seed enhancement has been added to reflect the significant advancements made in the last 10 years on new physiological and molecular biology techniques to further enhance seed performance.

Автор: Khalil, Tarek M.
Название: Management of Technology
ISBN: 0073228982 ISBN-13(EAN): 9780073228983
Издательство: McGraw-Hill
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Цена: 103810.00 T
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Автор: Kiyotaka Wasa
Название: Handbook of Sputter Deposition Technology,
ISBN: 1437734839 ISBN-13(EAN): 9781437734836
Издательство: Elsevier Science
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Цена: 140360.00 T
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Описание: Faetures a team of contributing authors with backgrounds specializing in the various new applications of sputtering technology. This book introduces the fundamentals of thin films and sputtering deposition, explores the theory and practices of this field, and also covers new technology such as nano-functional materials and MEMS.

Название: Seed Production. Principles and Practices, McDonald, Miller, Copeland, Lawrence O.-Springer; Softcover reprint of the original 1st ed. 1997 edition (July 31, 1997), 749 pages, Paperback
ISBN: 0412075512 ISBN-13(EAN): 9780412075513
Издательство: Springer
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Цена: 217680.00 T
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Описание: Rigorous production criteria are followed by both seed producer and seed companies to ensure that high-quality seed is produced and marketed. From this founda tion, the practices of seed production are provided in detail in Part II, Seed Production of Specific Crops.

Автор: Dennis R. Cooley
Название: Technology, Transgenics and a Practical Moral Code
ISBN: 9400730594 ISBN-13(EAN): 9789400730595
Издательство: Springer
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Цена: 139750.00 T
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Описание: Ethical debate often lags far behind the development of new technology. This book sets out a practical moral code with wide-ranging applicability, designed to include moral principles and a hierarchical value theory based partly on the work of Kant and Mill.

Автор: John Bird
Название: Electrical and Electronic Principles and Technology
ISBN: 0415662850 ISBN-13(EAN): 9780415662857
Издательство: Taylor&Francis
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Цена: 33670.00 T
Наличие на складе: Невозможна поставка.
Описание: This much-loved textbook introduces electrical and electronic principles and technology to students who are new to the subject. Real-world situations and engineering examples put the theory into context. The inclusion of worked problems with solutions really help aid your understanding and further problems then allow you to test and confirm you have mastered each subject. In total the books contains 410 worked problems, 540 further problems, 340 multiple-choice questions, 455 short-answer questions, and 7 revision tests with answers online. This an ideal text for vocational courses enabling a sound understanding of the knowledge required by technicians in fields such as electrical engineering, electronics and telecommunications. It will also be an excellent refresher for foundation and undergraduate degree students. It is supported by a companion website that contains solutions to the 540 questions in the practice exercises, formulae to help students answer the questions, multiple choice questions linked to each of the 23 chapters and information about the famous mathematicians and scientists mentioned in the book. Lecturers also have access to full solutions and the marking scheme for the 7 revision tests, lesson plans and illustrations from the book.

Автор: Nigel Hardwick; Maria Lodovica Gullino
Название: Knowledge and Technology Transfer for Plant Pathology
ISBN: 9400731884 ISBN-13(EAN): 9789400731882
Издательство: Springer
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Цена: 130590.00 T
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Описание: This book contains fuller versions of the papers and posters presented in the Knowledge and Technology Transfer and Teaching Plant Pathology sessions at the 9th International Congress of Plant Pathology held in Turin, Italy in 2008.

Автор: Y. Horie
Название: Shock Wave Science and Technology Reference Library, Vol. 2
ISBN: 3642061133 ISBN-13(EAN): 9783642061134
Издательство: Springer
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Цена: 222670.00 T
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Описание: This book is the first of several volumes on solids in the Shock Wave Science and Technology Reference Library. This is a unique collection, and the library as a whole sets out to comprehensively and authoritatively cover and review at research level the subject matter with all its ramifications.

Автор: Rini van Dongen
Название: Shock Wave Science and Technology Reference Library, Vol. 1
ISBN: 3642071473 ISBN-13(EAN): 9783642071478
Издательство: Springer
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Цена: 222670.00 T
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Описание: This book offers a timely reference on shock waves in multiphase flows, including new viewpoints and burgeoning developments. It also examines the relationship of shock waves with phase transitions and induced phase transitions as well as their interaction with solid foams, textiles, porous and granular media.

Автор: Rau, A. R. P.
Название: The Beauty of Physics: Patterns, Principles, and Perspectives
ISBN: 0198709919 ISBN-13(EAN): 9780198709916
Издательство: Oxford Academ
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Цена: 40650.00 T
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Описание: This is a book about ideas, patterns, and broad unifying themes in physics. Each chapter focuses on a different theme - such as dimensions, transformations, symmetries, and maps - beginning with simple examples accessible to all, then connecting them to more sophisticated realizations in more advanced topics of physics.

Автор: Chuan Seng Tan; Ronald J. Gutmann; L. Rafael Reif
Название: Wafer Level 3-D ICs Process Technology
ISBN: 1441945628 ISBN-13(EAN): 9781441945624
Издательство: Springer
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Цена: 174130.00 T
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Описание: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.