Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs, Brandon Noia; Krishnendu Chakrabarty

Автор: Manuel Barros; Jorge Guilherme; Nuno Horta
Название: Analog Circuits and Systems Optimization based on Evolutionary Computation Techniques
ISBN: 3642263232 ISBN-13(EAN): 9783642263231
Издательство: Springer
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Цена: 158380.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Transistor-level design for complex mixed-signal systems-on-chip remains difficult to automate. This book shows how a modified genetic algorithm kernel can improve efficiency in the analog IC design cycle and includes a worked example of the method.

Автор: Ali M. Niknejad; Robert G. Meyer
Название: Design, Simulation and Applications of Inductors and Transformers for Si RF ICs
ISBN: 1475773668 ISBN-13(EAN): 9781475773668
Издательство: Springer
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Цена: 130610.00 T
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Описание: These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Accurate knowledge of inductance values, quality factor (Q) and the influence of ad- cent elements (on-chip proximity effects) and substrate losses is essential.

Автор: Erik Larsson
Название: Introduction to Advanced System-on-Chip Test Design and Optimization
ISBN: 1441952691 ISBN-13(EAN): 9781441952691
Издательство: Springer
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Цена: 174130.00 T
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Описание: SOC test design and its optimization is the topic of Introduction to Advanced System-on-Chip Test Design and Optimization. The second part of the book discusses SOC related problems such as system modeling, test conflicts, power consumption, test access mechanism design, test scheduling and defect-oriented scheduling.

Автор: Manuel Barros; Jorge Guilherme; Nuno Horta
Название: Analog Circuits and Systems Optimization based on Evolutionary Computation Techniques
ISBN: 3642123457 ISBN-13(EAN): 9783642123450
Издательство: Springer
Рейтинг:
Цена: 158380.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Transistor-level design for complex mixed-signal systems-on-chip remains difficult to automate. This book shows how a modified genetic algorithm kernel can improve efficiency in the analog IC design cycle and includes a worked example of the method.

Автор: Swaminathan Madhavan
Название: Design and Modeling for 3D ICs and Interposers
ISBN: 9814508594 ISBN-13(EAN): 9789814508599
Издательство: World Scientific Publishing
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Цена: 111930.00 T
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Описание: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.