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Die attach materials for high temperature applications in microelectronics packaging, 


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Цена: 158380.00T
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При оформлении заказа до: 2025-07-28
Ориентировочная дата поставки: Август-начало Сентября
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Название:  Die attach materials for high temperature applications in microelectronics packaging
ISBN: 9783319992556
Издательство: Springer
Классификация:







ISBN-10: 3319992554
Обложка/Формат: Hardcover
Страницы: 279
Вес: 0.62 кг.
Дата издания: 07.02.2019
Язык: English
Издание: 1st ed. 2018
Иллюстрации: 100 tables, color; 121 illustrations, color; 54 illustrations, black and white; xiv, 286 p. 175 illus., 121 illus. in color.
Размер: 167 x 242 x 19
Читательская аудитория: Professional & vocational
Подзаголовок: Materials, processes, equipment, and reliability
Ссылка на Издательство: Link
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Поставляется из: Германии
Описание: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys.Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials;Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium;Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Дополнительное описание: Chapter 1: Silver Sintering and Soldering: Bonding Process and Comparison.- Chapter 2: Sintered Silver for LED Applications.- Chapter 3: Process Control of Sintered Ag Joint in Production for Die-Attach Applications.- Chapter 4: Thermomechanical Modeling


Автор: Chandra Mouli Pandey, Bansi Dhar Malhotra
Название: Biosensors: Fundamentals and Applications
ISBN: 3110637804 ISBN-13(EAN): 9783110637809
Издательство: Walter de Gruyter
Цена: 234410.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book focuses on the state-of-the-art of biosensor research and development for specialists and non-specialists. It introduces the fundamentals of the subject with relevant characteristics of transducer elements, as well as biochemical recognition molecules. This book is ideal for researchers of nanotechnology, materials science and biophysics.

Materials for Advanced Packaging

Автор: Daniel Lu; C.P. Wong
Название: Materials for Advanced Packaging
ISBN: 3319832093 ISBN-13(EAN): 9783319832098
Издательство: Springer
Рейтинг:
Цена: 186330.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a comprehensive overview of the recent developments in advanced packaging. Established techniques are discussed, as well as emerging technologies, in order to provide readers with the most up-to-date developments.

Scaling and integration of high-speed electronics and optomechanical systems

Название: Scaling and integration of high-speed electronics and optomechanical systems
ISBN: 9813225394 ISBN-13(EAN): 9789813225398
Издательство: World Scientific Publishing
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Цена: 109830.00 T
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Описание:

Coined as the third revolution in electronics is under way; Manufacturing is going digital, driven by computing revolution, powered by MOS technology, in particular, by the CMOS technology and its development.

In this book, the scaling challenges for CMOS: SiGe BiCMOS, THz and niche technology are covered; the first article looks at scaling challenges for CMOS from an industrial point of view (review of the latest innovations); the second article focuses on SiGe BiCMOS technologies (deals with high-speed up to the THz-region), and the third article reports on circuits associated with source/drain integration in 14 nm and beyond FinFET technology nodes. Followed by the last two articles on niche applications for emerging technologies: one deals with carbon nanotube network and plasmonics for the THz region carbon, while the other reviews the recent developments in integrated on-chip nano-optomechanical systems.


Novel Advances in Microsystems Technologies and Their Applications

Название: Novel Advances in Microsystems Technologies and Their Applications
ISBN: 1138072796 ISBN-13(EAN): 9781138072794
Издательство: Taylor&Francis
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Цена: 83690.00 T
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Описание:

Microsystems technologies have found their way into an impressive variety of applications, from mobile phones, computers, and displays to smart grids, electric cars, and space shuttles. This multidisciplinary field of research extends the current capabilities of standard integrated circuits in terms of materials and designs and complements them by creating innovative components and smaller systems that require lower power consumption and display better performance. Novel Advances in Microsystems Technologies and their Applications delves into the state of the art and the applications of microsystems and microelectronics-related technologies.

Featuring contributions by academic and industrial researchers from around the world, this book:

  • Examines organic and flexible electronics, from polymer solar cell to flexible interconnects for the co-integration of micro-electromechanical systems (MEMS) with complementary metal oxide semiconductors (CMOS)
  • Discusses imaging and display technologies, including MEMS technology in reflective displays, the fabrication of thin-film transistors on glass substrates, and new techniques to display and quickly transmit high-quality images
  • Explores sensor technologies for sensing electrical currents and temperature, monitoring structural health and critical industrial processes, and more
  • Covers biomedical microsystems, including biosensors, point-of-care devices, neural stimulation and recording, and ultra-low-power biomedical systems

Written for researchers, engineers, and graduate students in electrical and biomedical engineering, this book reviews groundbreaking technology, trends, and applications in microelectronics. Its coverage of the latest research serves as a source of inspiration for anyone interested in further developing microsystems technologies and creating new applications.


Nanoelectronic Device Applications Handbook

Название: Nanoelectronic Device Applications Handbook
ISBN: 1138072591 ISBN-13(EAN): 9781138072596
Издательство: Taylor&Francis
Рейтинг:
Цена: 107190.00 T
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Описание:

Nanoelectronic Device Applications Handbook gives a comprehensive snapshot of the state of the art in nanodevices for nanoelectronics applications. Combining breadth and depth, the book includes 68 chapters on topics that range from nano-scaled complementary metal-oxide-semiconductor (CMOS) devices through recent developments in nano capacitors and AlGaAs/GaAs devices. The contributors are world-renowned experts from academia and industry from around the globe.

The handbook explores current research into potentially disruptive technologies for a post-CMOS world. These include:

  • Nanoscale advances in current MOSFET/CMOS technology
  • Nano capacitors for applications such as electronics packaging and humidity sensors
  • Single electron transistors and other electron tunneling devices
  • Quantum cellular automata and nanomagnetic logic
  • Memristors as switching devices and for memory
  • Graphene preparation, properties, and devices
  • Carbon nanotubes (CNTs), both single CNT and random network
  • Other CNT applications such as terahertz, sensors, interconnects, and capacitors
  • Nano system architectures for reliability
  • Nanowire device fabrication and applications
  • Nanowire transistors
  • Nanodevices for spintronics

The book closes with a call for a new generation of simulation tools to handle nanoscale mechanisms in realistic nanodevice geometries.

This timely handbook offers a wealth of insights into the application of nanoelectronics. It is an invaluable reference and source of ideas for anyone working in the rapidly expanding field of nanoelectronics.


MEMS: A Practical Guide of Design, Analysis, and Applications

Автор: Jan Korvink; Oliver Paul
Название: MEMS: A Practical Guide of Design, Analysis, and Applications
ISBN: 3662568357 ISBN-13(EAN): 9783662568354
Издательство: Springer
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Цена: 186330.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: A new generation of MEMS books has emerged with this cohesive guide on the design and analysis of micro-electro-mechanical systems (MEMS). Satisfying a demand for literature on analysis and design of microsystems the book deals with a broad array of industrial applications.

Influence of Temperature on Microelectronics and System Reliability

Автор: Lall, Pradeep , Pecht, Michael G. , Hakim, Edwar
Название: Influence of Temperature on Microelectronics and System Reliability
ISBN: 0367400979 ISBN-13(EAN): 9780367400972
Издательство: Taylor&Francis
Рейтинг:
Цена: 61240.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures.

Thermal Stress and Strain in Microelectronics Packaging

Автор: John Lau
Название: Thermal Stress and Strain in Microelectronics Packaging
ISBN: 1468477692 ISBN-13(EAN): 9781468477696
Издательство: Springer
Рейтинг:
Цена: 113190.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications.

Electron-Emissive Materials, Vacuum Microelectronics and Flat-Panel Displays

Автор: Jensen
Название: Electron-Emissive Materials, Vacuum Microelectronics and Flat-Panel Displays
ISBN: 1107413060 ISBN-13(EAN): 9781107413061
Издательство: Cambridge Academ
Цена: 28510.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Microelectronics failure analysis desk reference

Название: Microelectronics failure analysis desk reference
ISBN: 162708245X ISBN-13(EAN): 9781627082457
Издательство: Mare Nostrum (Eurospan)
Рейтинг:
Цена: 209000.00 T
Наличие на складе: Невозможна поставка.
Описание: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples.Topics include:Failure Analysis Process and Management—wafer, package, and board level failure analysis flow.Incoming Inspection Tools—optical, x-ray, and scanning acoustic microscopy.Fault Isolation—front and backside sample prepara­tion, CAD navigation, laser-assisted device alteration (LADA), soft defect location (SDL), lock-in thermog­raphy, laser voltage probing (LVP), photon emission, EOTPR/TDR/TDT, and current imaging.Device and Circuit Characterization—scanning electron microscopy (SEM)-based and atomic force microscopy (AFM)-based nanoprobing.FIB Technique and Circuit Edit— FIB overview and advanced circuit edit for first silicon debug.Physical Analysis—deprocessing, cross section analysis, scanning electron microscopy, material analysis techniques, transmission electron micros­copy (TEM), and scanning probe microscopy.Memory FA—DRAM, semiconductor memory failure signature analysis.Special Applications—automotive FA, 2.5 and 3D packaging failure analysis, microelectromechanical systems (MEMS), optoelectronics, solar, and counterfeit electronics.Fundamental Topics—integrated circuit testing, analog design, reliability, quality, and training.Seven new topics have been added and all themes covered in earlier editions are included in the Seventh Edition. Many previous articles have been updated.

Materials Science of High Temperature Polymers for Microelectronics

Автор: Grubb
Название: Materials Science of High Temperature Polymers for Microelectronics
ISBN: 1107409853 ISBN-13(EAN): 9781107409859
Издательство: Cambridge Academ
Цена: 27450.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Microwave and RF Design, Volume 1: Radio Systems

Автор: Steer Michael
Название: Microwave and RF Design, Volume 1: Radio Systems
ISBN: 1469656906 ISBN-13(EAN): 9781469656908
Издательство: Mare Nostrum (Eurospan)
Рейтинг:
Цена: 13370.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Microwave and RF Design: Radio Systems is a circuits- and systems-oriented approach to modern microwave and RF systems. Sufficient details at the circuits and sub-system levels are provided to understand how modern radios are implemented. Design is emphasized throughout. The evolution of radio from what is now known as 0G, for early radio, through to 6G, for sixth generation cellular radio, is used to present modern microwave and RF engineering concepts. Two key themes unify the text: 1) how system-level decisions affect component, circuit and subsystem design; and 2) how the capabilities of technologies, components, and subsystems impact system design. This book is suitable as both an undergraduate and graduate textbook, as well as a career-long reference book.

Key Features
* The first volume of a comprehensive series on microwave and RF design
* Open access ebook editions are hosted by NC State University Libraries at https: //repository.lib.ncsu.edu/handle/1840.20/36776
* 31 worked examples
* An average of 38 exercises per chapter
* Answers to selected exercises
* Coverage of cellular radio from 1G through 6G
* Case study of a software defined radio illustrating how modern radios partition functionality between analog and digital domains
* A companion book, Fundamentals of Microwave and RF Design, is suitable as a comprehensive undergraduate textbook on microwave engineering



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