Автор: John H. Lau Название: Fan-Out Wafer-Level Packaging ISBN: 9811342660 ISBN-13(EAN): 9789811342660 Издательство: Springer Рейтинг: Цена: 93160.00 T Наличие на складе: Поставка под заказ. Описание: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
Автор: Keser Название: Embedded and Fan-Out Wafer Level Packaging Technol ogies ISBN: 1119314135 ISBN-13(EAN): 9781119314134 Издательство: Wiley Рейтинг: Цена: 123500.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание:
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges
Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons.
Filled with contributions from some of the field's leading experts, Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions.
Discusses specific company standards and their development results
Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Автор: Shichun Qu; Yong Liu Название: Wafer-Level Chip-Scale Packaging ISBN: 149391555X ISBN-13(EAN): 9781493915552 Издательство: Springer Рейтинг: Цена: 130430.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
Название: Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) ISBN: 9811201110 ISBN-13(EAN): 9789811201110 Издательство: World Scientific Publishing Рейтинг: Цена: 1309440.00 T Наличие на складе: Невозможна поставка. Описание: Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Автор: Reinhardt, Karen Название: Handbook of Silicon Wafer Cleaning Technology ISBN: 0323510841 ISBN-13(EAN): 9780323510844 Издательство: Elsevier Science Рейтинг: Цена: 263880.00 T Наличие на складе: Поставка под заказ. Описание:
Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results.
The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination.
The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others.
Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits
Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries
Covers processes and equipment, as well as new materials and changes required for the surface conditioning process
Автор: Stuart K. Tewksbury Название: Wafer-Level Integrated Systems ISBN: 0792390067 ISBN-13(EAN): 9780792390060 Издательство: Springer Рейтинг: Цена: 204040.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: From the perspective of complex systems, conventional Ie`s can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy.
Автор: Chuan Seng Tan; Ronald J. Gutmann; L. Rafael Reif Название: Wafer Level 3-D ICs Process Technology ISBN: 1441945628 ISBN-13(EAN): 9781441945624 Издательство: Springer Рейтинг: Цена: 174130.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.
Автор: Stuart K. Tewksbury Название: Wafer-Level Integrated Systems ISBN: 1461288983 ISBN-13(EAN): 9781461288985 Издательство: Springer Рейтинг: Цена: 204040.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: From the perspective of complex systems, conventional Ie`s can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy.
Автор: Earl E. Swartzlander Jr. Название: Wafer Scale Integration ISBN: 0792390032 ISBN-13(EAN): 9780792390039 Издательство: Springer Рейтинг: Цена: 278580.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer.
Автор: Marin Alexe; Ulrich G?sele Название: Wafer Bonding ISBN: 3642059155 ISBN-13(EAN): 9783642059155 Издательство: Springer Рейтинг: Цена: 217670.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off.
Автор: Linda F. Atherton; Robert W. Atherton Название: Wafer Fabrication: Factory Performance and Analysis ISBN: 0792396197 ISBN-13(EAN): 9780792396192 Издательство: Springer Рейтинг: Цена: 217680.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Understanding the details of wafer fabrication processes and the related aspects of electronic devices can be an overwhelming task in the absence of a systematic, comprehensive view of the technology. This book presents a treatment of both the technology of wafer fabrication and the factories where it occurs.
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