Encapsulation Technologies for Electronic Applications 9780128119785

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Автор: Zhang, Jiawei
Название: Encapsulation Technologies for Electronic Applications
ISBN: 9780128119785
Издательство: Elsevier Science
Классификация:

Материаловедение

Электроника и техника связи

Электроника

Электронные устройства и материалы

ISBN-10: 0128119780
Обложка/Формат: Paperback
Страницы: 550
Вес: 0.88 кг.
Дата издания: 01.05.2018
Серия: Materials and processes for electronic applications
Язык: English
Издание: 2 ed
Размер: 229 x 152 x 26
Основная тема: Electrical Engineering
Ссылка на Издательство: Link
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Поставляется из: Европейский союз
Описание:

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly green encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages.

In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology.

Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.

Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics
Includes coverage of environmentally friendly green encapsulants
Presents coverage of faults and defects, and how to analyze and avoid them

Encapsulation Technologies for Electronic Applications, Zhang, Jiawei