The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages, Gerard Kelly

Автор: X.J. Fan; E. Suhir
Название: Moisture Sensitivity of Plastic Packages of IC Devices
ISBN: 1461426251 ISBN-13(EAN): 9781461426257
Издательство: Springer
Рейтинг:
Цена: 232910.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. It includes numerous industrial applications, along with the results of the most recent research and development efforts.

Автор: P. Singh; Puligandla Viswanadham
Название: Failure Modes and Mechanisms in Electronic Packages
ISBN: 1461377633 ISBN-13(EAN): 9781461377634
Издательство: Springer
Рейтинг:
Цена: 174150.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.