High Thermal Conductivity Materials, Subhash L. Shinde; Jitendra Goela
Автор: Tritt Terry M. Название: Thermal Conductivity / Theory, Properties, and Applications ISBN: 0306483270 ISBN-13(EAN): 9780306483271 Издательство: Springer Рейтинг: Цена: 204970.00 T Наличие на складе: Невозможна поставка. Описание: It has been almost thirty years since the publication of a book that is entirely dedicated to the theory, description, characterization and measurement of the thermal conductivity of solids. The recent discovery of new materials which possess more complex crystal structures and thus more complicated phonon scattering mechanisms have brought innovative challenges to the theory and experimental understanding of these new materials. With the development of new and novel solid materials and new measurement techniques, this book will serve as a current and extensive resource to the next generation researchers in the field of thermal conductivity. This book is a valuable resource for research groups and special topics courses (8-10 students), for 1st or 2nd year graduate level courses in Thermal Properties of Solids, special topics courses in Thermal Conductivity, Superconductors and Magnetic Materials, and to researchers in Thermoelectrics, Thermal Barrier Materials and Solid State Physics.
Автор: V. V. Mirkovich Название: Thermal Conductivity 15 ISBN: 146159085X ISBN-13(EAN): 9781461590859 Издательство: Springer Рейтинг: Цена: 95770.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: I am sure the time has come when Con- ference Chairmen in coming years will be soliciting contributions not only in the physical sciences and engineering`, but will actively seek contributions from the earth sciences and life sciences as well.
Автор: J.R., Jr. Thomas; D.P.H. Hasselman Название: Thermal Conductivity 20 ISBN: 1461280699 ISBN-13(EAN): 9781461280699 Издательство: Springer Рейтинг: Цена: 81050.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: The Conferences were held annually from 1961 to 1973 and have been held biennially since 1975 when our Center for Informa- tion and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences.
Автор: T. Ashworth; David R. Smith Название: Thermal Conductivity 18 ISBN: 1468449184 ISBN-13(EAN): 9781468449181 Издательство: Springer Рейтинг: Цена: 113190.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: The Conferences were held annu- ally from 1961 to 1973 and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences.
Автор: David C. Larsen Название: Thermal Conductivity 16 ISBN: 1468442678 ISBN-13(EAN): 9781468442670 Издательство: Springer Рейтинг: Цена: 113190.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: From 1961 to 1973 the Confer- ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon- sor of the Conferences.
Автор: J. G. Hust Название: Thermal Conductivity 17 ISBN: 1489954384 ISBN-13(EAN): 9781489954381 Издательство: Springer Рейтинг: Цена: 46570.00 T Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: P. Klemens Название: Thermal Conductivity 14 ISBN: 1489937536 ISBN-13(EAN): 9781489937537 Издательство: Springer Рейтинг: Цена: 46570.00 T Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: C.J. Cremers; H.A. Fine Название: Thermal Conductivity ISBN: 0306436728 ISBN-13(EAN): 9780306436727 Издательство: Springer Рейтинг: Цена: 261210.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Fifty-one papers (and three keynote addresses) on contemporary theoretical issues and experimental techniques pertaining to the underlying factors that control heat-conduction behavior of materials. The latest findings on insulation, fluids, and low-dimensional solids and composites are reviewed as
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