Автор: Tritt Terry M. Название: Thermal Conductivity / Theory, Properties, and Applications ISBN: 0306483270 ISBN-13(EAN): 9780306483271 Издательство: Springer Рейтинг: Цена: 204970.00 T Наличие на складе: Невозможна поставка. Описание: It has been almost thirty years since the publication of a book that is entirely dedicated to the theory, description, characterization and measurement of the thermal conductivity of solids. The recent discovery of new materials which possess more complex crystal structures and thus more complicated phonon scattering mechanisms have brought innovative challenges to the theory and experimental understanding of these new materials. With the development of new and novel solid materials and new measurement techniques, this book will serve as a current and extensive resource to the next generation researchers in the field of thermal conductivity. This book is a valuable resource for research groups and special topics courses (8-10 students), for 1st or 2nd year graduate level courses in Thermal Properties of Solids, special topics courses in Thermal Conductivity, Superconductors and Magnetic Materials, and to researchers in Thermoelectrics, Thermal Barrier Materials and Solid State Physics.
Автор: Shlimak Issai Название: Is Hopping a Science?: Selected Topics of Hopping Conductivity ISBN: 9814663336 ISBN-13(EAN): 9789814663335 Издательство: World Scientific Publishing Рейтинг: Цена: 61250.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: The book provides an overview of the author`s work devoted to experimental study of hopping conductivity
Автор: Subhash L. Shinde; Jitendra Goela Название: High Thermal Conductivity Materials ISBN: 1441919562 ISBN-13(EAN): 9781441919564 Издательство: Springer Рейтинг: Цена: 130590.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Thedemandfore?cientthermalmanagementhasincreasedsubstantiallyover the last decade in every imaginable area, be it a formula 1 racing car suddenly braking to decelerate from 200 to 50 mph going around a sharp corner, a space shuttle entering the earth's atmosphere, or an advanced microproc- sor operating at a very high speed. The temperatures at the hot junctions are extremely high and the thermal ?ux can reach values higher than a few 2 hundred to a thousand watts/cm in these applications. To take a speci?c example of the microelectronics area, the chip heat ?ux for CMOS microp- cessors, though moderate compared to the numbers mentioned above have 2 already reached values close to 100 W/cm, and are projected to increase 2 above 200 W/cm over the next few years. Although the thermal mana- ment strategies for microprocessors do involve power optimization through improved design, it is extremely di?cult to eliminate "hot spots" completely. This is where high thermal conductivity materials ?nd most of their appli- tions, as "heat spreaders." The high thermal conductivity of these materials allows the heat to be carried away from the "hot spots" very quickly in all directions thereby "spreading" the heat. Heat spreading reduces the heat ?ux density, and thus makes it possible to cool systems using standard cooling solutions like ?nned heat sinks with forced air cooling.
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