Knowledge and Technology Integration in Production and Services, Vladim?r Mar?k; Luis M. Camarinha-Matos; Hamideh A

Автор: Karl-Heinz Gonschorek; Ralf Vick
Название: Electromagnetic Compatibility for Device Design and System Integration
ISBN: 3642424236 ISBN-13(EAN): 9783642424236
Издательство: Springer
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Цена: 139310.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Fulfilling emission limits and immunity requirements, and handling complex cases of incompatibility demands understanding of physical interrelations and of Maxwell`s theory. Based on the authors` experiences, the textbook helps solve such interferential cases.

Автор: Peter Kinget; Michiel Steyaert
Название: Analog VLSI Integration of Massive Parallel Signal Processing Systems
ISBN: 0792398238 ISBN-13(EAN): 9780792398233
Издательство: Springer
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Цена: 213360.00 T
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Описание: This text describes in depth the theory and practice of designing massively parallel analog signal processing systems. Techniques are described which overcome the device and transistor mismatches which limit performance of the system.

Автор: Vladim?r Mar?k; Luis M. Camarinha-Matos; Hamideh A
Название: Knowledge and Technology Integration in Production and Services
ISBN: 1475756321 ISBN-13(EAN): 9781475756326
Издательство: Springer
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Цена: 186330.00 T
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Описание: Knowledge and Technology Integration in Production and Services presents novel application scenarios for balanced distributed and integrated systems based on knowledge and up-to-date technology and provides a great opportunity for discussion of concepts, models, methodologies, technological developments, case studies, new research ideas, and other results among specialists. It comprises the proceedings of the Fifth International Conference on Information Technology for BALANCED AUTOMATION SYSTEMS in Manufacturing and Services (BASYS'02), which was sponsored by the International Federation for Information Processing (IFIP) and held in September 2002 in Cancun, Mexico.
BASYS'02 aimed mainly at balancing knowledge and technology in manufacturing, services and the product life-cycle. Namely, a balance is considered between local knowledge-intensive solutions and global performance in highly distributed systems, based on diverse technologies (such as virtual organizations, holonic manufacturing systems or multi-agent systems for design and diagnostics). The contributions are focused on interoperability and standardization issues, open architectures as well as knowledge-based integration paradigms, with special attention being paid to product-service integration, customer-production integration, and product life-cycle stages integration.
This book is essential reading for researchers, industrial managers, practitioners, developers, users or technology transfer experts - working in quite different fields such as automatic control, systems planning and integration, enterprise architecture, planning and scheduling, flexible manufacturing, knowledge engineering, business processes management or in the field of social impact studies.

Автор: Jeffrey A. Davis; James D. Meindl
Название: Interconnect Technology and Design for Gigascale Integration
ISBN: 1461350883 ISBN-13(EAN): 9781461350880
Издательство: Springer
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Цена: 139750.00 T
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Описание: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM`s revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.

Автор: Lutz Walter; George-Alexander Kartsounis; Stefano
Название: Transforming Clothing Production into a Demand-driven, Knowledge-based, High-tech Industry
ISBN: 1447157672 ISBN-13(EAN): 9781447157670
Издательство: Springer
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Цена: 130590.00 T
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Описание: New trends in the fashion market dictate the need for a new approach. This book discusses such an approach, which must be a shorter cycle from conception to retail, as well as a shift from labor-intensive to technology- and knowledge-intensive manufacturing.

Автор: Garrou Philip
Название: Handbook of 3d Integration V1 and 2
ISBN: 3527332650 ISBN-13(EAN): 9783527332656
Издательство: Wiley
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Цена: 154120.00 T
Наличие на складе: Поставка под заказ.
Описание: With contributions from key players in both academia and industry, this first encompassing treatise of this important field puts the known physical limitations for classic 2D electronics into perspective with the need for further electronics developments and market necessities.

Автор: Darabi
Название: Integration of Passive RF Front End Components in SoCs
ISBN: 0521111269 ISBN-13(EAN): 9780521111263
Издательство: Cambridge Academ
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Цена: 93970.00 T
Наличие на складе: Поставка под заказ.
Описание: Examining key developments in highly integrated wireless RF front ends, this book describes problems with the use of surface acoustic wave (SAW) filters, evaluates alternative solutions for on-chip high-Q filtering, and presents M-phase filters in depth. This is core reading for practitioners and researchers in RF integrated circuit design.

Автор: Garrou P
Название: Handbook of 3D Integration V 3
ISBN: 3527334661 ISBN-13(EAN): 9783527334667
Издательство: Wiley
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Цена: 150950.00 T
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Описание: Edited by key figures in the field and written by top authors from academia and industry, this book covers the intricate details of 3D process technology from both a technological and a materials science perspective.

Автор: Kiyotaka Wasa
Название: Handbook of Sputter Deposition Technology,
ISBN: 1437734839 ISBN-13(EAN): 9781437734836
Издательство: Elsevier Science
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Цена: 140360.00 T
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Описание: Faetures a team of contributing authors with backgrounds specializing in the various new applications of sputtering technology. This book introduces the fundamentals of thin films and sputtering deposition, explores the theory and practices of this field, and also covers new technology such as nano-functional materials and MEMS.

Автор: Sixto Gim?nez (Editor), Juan Bisquert (Editor)
Название: Photoelectrochemical Solar Fuel Production: From Basic Principles to Advanced Devices
ISBN: 3319296396 ISBN-13(EAN): 9783319296395
Издательство: Springer
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Цена: 139310.00 T
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Описание: The second section describes a collection of current, relevant characterization techniques, which provide essential information of the band structure of the semiconductors and carrier dynamics at the interface semiconductor.

Автор: John Bird
Название: Electrical and Electronic Principles and Technology
ISBN: 0415662850 ISBN-13(EAN): 9780415662857
Издательство: Taylor&Francis
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Цена: 33670.00 T
Наличие на складе: Невозможна поставка.
Описание: This much-loved textbook introduces electrical and electronic principles and technology to students who are new to the subject. Real-world situations and engineering examples put the theory into context. The inclusion of worked problems with solutions really help aid your understanding and further problems then allow you to test and confirm you have mastered each subject. In total the books contains 410 worked problems, 540 further problems, 340 multiple-choice questions, 455 short-answer questions, and 7 revision tests with answers online. This an ideal text for vocational courses enabling a sound understanding of the knowledge required by technicians in fields such as electrical engineering, electronics and telecommunications. It will also be an excellent refresher for foundation and undergraduate degree students. It is supported by a companion website that contains solutions to the 540 questions in the practice exercises, formulae to help students answer the questions, multiple choice questions linked to each of the 23 chapters and information about the famous mathematicians and scientists mentioned in the book. Lecturers also have access to full solutions and the marking scheme for the 7 revision tests, lesson plans and illustrations from the book.

Автор: S.D. Brotherton
Название: Introduction to Thin Film Transistors: Physics and Technology of TFTs
ISBN: 3319000012 ISBN-13(EAN): 9783319000015
Издательство: Springer
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Цена: 69870.00 T
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Описание: This book surveys the technology and applications of TFTs, covering hydrogenated amorphous silicon, poly-crystalline silicon, transparent amorphous oxide semiconductors, organic semiconductors and others that form the core of the flat panel display industry.