Adhesion in Microelectronics, Mittal

Автор: K.W. Allen
Название: Adhesion 14
ISBN: 9401068275 ISBN-13(EAN): 9789401068277
Издательство: Springer
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Цена: 95770.00 T
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Описание: As interest in the whole science and technology of adhesion and adhesives grows, so do the meetings concerned with it proliferate. further, that we are enabled to reach a wider audience through the publication of the papers presented at the conference in this series of volumes.

Автор: K.W. Allen
Название: Adhesion 12
ISBN: 9401071004 ISBN-13(EAN): 9789401071000
Издательство: Springer
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Цена: 46570.00 T
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Описание: It was in the light of this situation that here at City University we set about arranging the Twenty-fifth Annual Conference on Adhesion and Adhesives, of which this volume presents the proceedings.

Автор: Mittal
Название: Particle Adhesion and Removal
ISBN: 1118831535 ISBN-13(EAN): 9781118831533
Издательство: Wiley
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Цена: 184750.00 T
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Автор: Mittal
Название: Laser Surface Modification and Adhesion
ISBN: 1118831632 ISBN-13(EAN): 9781118831632
Издательство: Wiley
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Цена: 184750.00 T
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Автор: K.W. Allen
Название: Adhesion 9
ISBN: 9401086885 ISBN-13(EAN): 9789401086882
Издательство: Springer
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Цена: 81050.00 T
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Описание: Both of these topics are reflected in various meetings and nowhere more consistently than at the Annual Conference on Adhesion and Adhesives at The City University each Easter. Packham (School of Materials Science, University of Bath, Claverton Down, Bath BA2 7 A Y, UK) 4.

Автор: K.W. Allen
Название: Adhesion 11
ISBN: 9401080364 ISBN-13(EAN): 9789401080361
Издательство: Springer
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Цена: 81050.00 T
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Описание: Each year, about Easter time, we are reminded of the continuing growth in the use of adhesives. Some Aspects of Silane Technology for Surface Coatings and Adhesives 17 C. Walker (SCT Materials, Atomic Weapons Research Establishment, Building SB43, Aldermaston, Reading, Berkshire RG74PR, UK) 3.

Автор: K.W. Allen
Название: Adhesion 13
ISBN: 940109084X ISBN-13(EAN): 9789401090841
Издательство: Springer
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Цена: 46570.00 T
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Автор: Seonho Seok
Название: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
ISBN: 3030085619 ISBN-13(EAN): 9783030085612
Издательство: Springer
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Цена: 130430.00 T
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Описание: This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

Автор: Tuhin Subhra Santra
Название: Microfluidics and BioMEMS
ISBN: 9814800856 ISBN-13(EAN): 9789814800853
Издательство: Taylor&Francis
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Цена: 118410.00 T
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Описание: This book compiles cutting-edge research on cell manipulation, separation, and analysis using microfluidics and bio-MEMS. It illustrates the use of micro-robots for biomedical applications, vascularized microfluidic organs-on-a-chip and their applications, as well as DNA gene microarray biochips and their applications

Автор: Simon Deleonibus
Название: Convergence of More Moore, More than Moore and Beyond Moore
ISBN: 9814877123 ISBN-13(EAN): 9789814877121
Издательство: Taylor&Francis
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Цена: 141890.00 T
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Описание: The era of Sustainable and Energy Efficient Nanoelectronics and Nanosystems has come. The research and development on Scalable and 3D integrated Diversified functions together with new computing architectures is in full swing.

Автор: Bruce W. Smith, Kazuaki Suzuki
Название: Microlithography Science &Tech
ISBN: 1439876754 ISBN-13(EAN): 9781439876756
Издательство: Taylor&Francis
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Цена: 168430.00 T
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Описание: Like the bestselling original, this third edition of Microlithography is a self-contained text detailing both elementary and advanced aspects of submicron microlithography, offering a balanced treatment of theoretical and operating practices.

Название: Nanoscale Silicon Devices
ISBN: 113874932X ISBN-13(EAN): 9781138749320
Издательство: Taylor&Francis
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Цена: 64300.00 T
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Описание: Is Bigger Always Better? Explore the Behavior of Very Small Devices as Described by Quantum Mechanics Smaller is better when it comes to the semiconductor transistor. Nanoscale Silicon Devices examines the growth of semiconductor device miniaturization and related advances in material, device, circuit, and system design, and highlights the use of device scaling within the semiconductor industry. Device scaling, the practice of continuously scaling down the size of metal-oxide-semiconductor field-effect transistors (MOSFETs), has significantly improved the performance of small computers, mobile phones, and similar devices. The practice has resulted in smaller delay time and higher device density in a chip without an increase in power consumption. This book covers recent advancements and considers the future prospects of nanoscale silicon (Si) devices. It provides an introduction to new concepts (including variability in scaled MOSFETs, thermal effects, spintronics-based nonvolatile computing systems, spin-based qubits, magnetoelectric devices, NEMS devices, tunnel FETs, dopant engineering, and single-electron transfer), new materials (such as high-k dielectrics and germanium), and new device structures in three dimensions. It covers the fundamentals of such devices, describes the physics and modeling of these devices, and advocates further device scaling and minimization of energy consumption in future large-scale integrated circuits (VLSI). Additional coverage includes: Physics of nm scaled devices in terms of quantum mechanics Advanced 3D transistors: tri-gate structure and thermal effects Variability in scaled MOSFET Spintronics on Si platform NEMS devices for switching, memory, and sensor applications The concept of ballistic transport The present status of the transistor variability and more An indispensable resource, Nanoscale Silicon Devices serves device engineers and academic researchers (including graduate students) in the fields of electron devices, solid-state physics, and nanotechnology.