Adhesion in Microelectronics, Mittal

Автор: K.W. Allen
Название: Adhesion 14
ISBN: 9401068275 ISBN-13(EAN): 9789401068277
Издательство: Springer
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Цена: 95770.00 T
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Описание: As interest in the whole science and technology of adhesion and adhesives grows, so do the meetings concerned with it proliferate. further, that we are enabled to reach a wider audience through the publication of the papers presented at the conference in this series of volumes.

Автор: K.W. Allen
Название: Adhesion 12
ISBN: 9401071004 ISBN-13(EAN): 9789401071000
Издательство: Springer
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Цена: 46570.00 T
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Описание: It was in the light of this situation that here at City University we set about arranging the Twenty-fifth Annual Conference on Adhesion and Adhesives, of which this volume presents the proceedings.

Автор: Mittal
Название: Particle Adhesion and Removal
ISBN: 1118831535 ISBN-13(EAN): 9781118831533
Издательство: Wiley
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Цена: 184750.00 T
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Автор: Mittal
Название: Laser Surface Modification and Adhesion
ISBN: 1118831632 ISBN-13(EAN): 9781118831632
Издательство: Wiley
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Автор: K.W. Allen
Название: Adhesion 9
ISBN: 9401086885 ISBN-13(EAN): 9789401086882
Издательство: Springer
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Цена: 81050.00 T
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Описание: Both of these topics are reflected in various meetings and nowhere more consistently than at the Annual Conference on Adhesion and Adhesives at The City University each Easter. Packham (School of Materials Science, University of Bath, Claverton Down, Bath BA2 7 A Y, UK) 4.

Автор: K.W. Allen
Название: Adhesion 11
ISBN: 9401080364 ISBN-13(EAN): 9789401080361
Издательство: Springer
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Цена: 81050.00 T
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Описание: Each year, about Easter time, we are reminded of the continuing growth in the use of adhesives. Some Aspects of Silane Technology for Surface Coatings and Adhesives 17 C. Walker (SCT Materials, Atomic Weapons Research Establishment, Building SB43, Aldermaston, Reading, Berkshire RG74PR, UK) 3.

Автор: K.W. Allen
Название: Adhesion 13
ISBN: 940109084X ISBN-13(EAN): 9789401090841
Издательство: Springer
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Автор: Uhrmann, Heimo Kolm, Robert Zimmermann, Horst
Название: Analog filters in nanometer cmos
ISBN: 3642380123 ISBN-13(EAN): 9783642380129
Издательство: Springer
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Цена: 111790.00 T
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Описание: This book presents recent results in the development of analog filters in nanometer CMOS. It describes methods for successfully dealing with nanometer devices and includes numerous detailed circuit diagrams and plots of measured results.

Автор: Cristoloveanu Sorin, Michael S. Shur
Название: Frontiers in Electronics: Selected Papers from the Workshop on Frontiers in Electronics 2013 (Wofe-13): Selected Papers from the Workshop on Fro
ISBN: 9814651761 ISBN-13(EAN): 9789814651769
Издательство: World Scientific Publishing
Цена: 100320.00 T
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Описание: This book brings together 11 invited papers from the Workshop on Frontiers in Electronics (WOFE) 2013 that took place at San Juan, Puerto Rico, in December 2013.

Автор: Seonho Seok
Название: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
ISBN: 3030085619 ISBN-13(EAN): 9783030085612
Издательство: Springer
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Цена: 130430.00 T
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Описание: This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

Автор: Tuhin Subhra Santra
Название: Microfluidics and BioMEMS
ISBN: 9814800856 ISBN-13(EAN): 9789814800853
Издательство: Taylor&Francis
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Цена: 118410.00 T
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Описание: This book compiles cutting-edge research on cell manipulation, separation, and analysis using microfluidics and bio-MEMS. It illustrates the use of micro-robots for biomedical applications, vascularized microfluidic organs-on-a-chip and their applications, as well as DNA gene microarray biochips and their applications

Автор: Simon Deleonibus
Название: Convergence of More Moore, More than Moore and Beyond Moore
ISBN: 9814877123 ISBN-13(EAN): 9789814877121
Издательство: Taylor&Francis
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Цена: 141890.00 T
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Описание: The era of Sustainable and Energy Efficient Nanoelectronics and Nanosystems has come. The research and development on Scalable and 3D integrated Diversified functions together with new computing architectures is in full swing.