Advances in Micro-Electronics, Embedded Systems and IoT, Chakravarthy
Автор: Erickson Robert W., Maksimovic Dragan Название: Fundamentals of Power Electronics ISBN: 3030438791 ISBN-13(EAN): 9783030438791 Издательство: Springer Рейтинг: Цена: 83850.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Fundamentals of Power Electronics, Third Edition, is an up-to-date and authoritative text and reference book on power electronics.
Автор: Twomey, Jerry Название: Applied embedded electronics ISBN: 1098144791 ISBN-13(EAN): 9781098144791 Издательство: Неизвестно Рейтинг: Цена: 47510.00 T Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: Ashby, Darren (electronics Product Line Manager, Icon Fitness, One Of The World`s Largest Consumers Of Embedded Chips, Salt Lake City, Ut, Usa) Название: Electrical engineering 101 ISBN: 0123860016 ISBN-13(EAN): 9780123860019 Издательство: Elsevier Science Рейтинг: Цена: 31430.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Covers the basic theory and practice of electronics, starting by answering the question `What is electricity? This title goes on to explain the fundamental principles and components, relating them constantly to real-world examples. It delves into how and why electricity and electronics work.
Автор: Chakravarthy V. V. S. S. S., Flores-Fuentes Wendy, Bhateja Vikrant Название: Advances in Micro-Electronics, Embedded Systems and IoT: Proceedings of Sixth International Conference on Microelectronics, Electromagnetics and Telec ISBN: 9811685495 ISBN-13(EAN): 9789811685491 Издательство: Springer Рейтинг: Цена: 232910.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2021), held in Bhubaneswar, Odisha, India during 27 – 28 August 2021. The papers were written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today’s society.
Автор: Kalya Shubhakar, Kulkarni Muralidhar, Shivaprakasha K. S. Название: Advances in Vlsi, Signal Processing, Power Electronics, Iot, Communication and Embedded Systems: Select Proceedings of Vspice 2020 ISBN: 9811604428 ISBN-13(EAN): 9789811604423 Издательство: Springer Цена: 232910.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This book comprises select peer-reviewed papers from the International Conference on VLSI, Signal Processing, Power Electronics, IoT, Communication and Embedded Systems (VSPICE-2020). The various topics covered in this book include VLSI, embedded systems, signal processing, communication, power electronics and internet of things.
Автор: Kalya Shubhakar, Kulkarni Muralidhar, Shivaprakasha K. S. Название: Advances in VLSI, Signal Processing, Power Electronics, IoT, Communication and Embedded Systems: Select Proceedings of VSPICE 2020 ISBN: 9811604452 ISBN-13(EAN): 9789811604454 Издательство: Springer Рейтинг: Цена: 232910.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This book comprises select peer-reviewed papers from the International Conference on VLSI, Signal Processing, Power Electronics, IoT, Communication and Embedded Systems (VSPICE-2020). The various topics covered in this book include VLSI, embedded systems, signal processing, communication, power electronics and internet of things.
Автор: Keser Название: Embedded and Fan-Out Wafer Level Packaging Technol ogies ISBN: 1119314135 ISBN-13(EAN): 9781119314134 Издательство: Wiley Рейтинг: Цена: 123500.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание:
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges
Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons.
Filled with contributions from some of the field's leading experts, Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions.
Discusses specific company standards and their development results
Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Автор: Bindal, Ahmet Название: Electronics for embedded systems ISBN: 3319394371 ISBN-13(EAN): 9783319394374 Издательство: Springer Рейтинг: Цена: 69870.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Fundamentals of Passive Circuit Analysis.- Diode and Bipolar Transistor Circuits.- MOS Transistors and CMOS Circuits.- TTL Logic and CMOS-TTL Interface.- Physics of Sensors.- Operational Amplifiers and Circuits.- Data Converters.- Front-End Electronics for Embedded Systems.- Review of Combinational and Sequential Logic Circuits and Design.
Автор: Eric Peeters Название: Advanced DPA Theory and Practice ISBN: 1461467829 ISBN-13(EAN): 9781461467823 Издательство: Springer Рейтинг: Цена: 121110.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Here is a thorough survey of new physical leakages of embedded systems, namely power and electromagnetic emanations. Discusses such advanced statistical methods to attack embedded devices as high-order attack, template attack in principal subspaces and more.
Автор: Sriram Название: Embedded Multiprocessors ISBN: 1138114170 ISBN-13(EAN): 9781138114173 Издательство: Taylor&Francis Рейтинг: Цена: 78590.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание:
Techniques for Optimizing Multiprocessor Implementations of Signal Processing Applications
An indispensable component of the information age, signal processing is embedded in a variety of consumer devices, including cell phones and digital television, as well as in communication infrastructure, such as media servers and cellular base stations. Multiple programmable processors, along with custom hardware running in parallel, are needed to achieve the computation throughput required of such applications.
Reviews important research in key areas related to the multiprocessor implementation of multimedia systems Embedded Multiprocessors: Scheduling and Synchronization, Second Edition presents architectures and design methodologies for parallel systems in embedded digital signal processing (DSP) applications. It discusses application modeling techniques for multimedia systems, the incorporation of interprocessor communication costs into multiprocessor scheduling decisions, and a modeling methodology (the synchronization graph) for multiprocessor system performance analysis. The book also applies the synchronization graph model to develop hardware and software optimizations that can significantly reduce the interprocessor communication overhead of a given schedule.
Chronicles recent activity dealing with single-chip multiprocessors and dataflow models This edition updates the background material on existing embedded multiprocessors, including single-chip multiprocessors. It also summarizes the new research on dataflow models for signal processing that has been carried out since the publication of the first edition.
Harness the power of multiprocessors This book explores the optimization of interprocessor communication and synchronization in embedded multiprocessor systems. It shows you how to design multiprocessor computer systems that are streamlined for multimedia applications.
Название: Communication Architectures for Systems-on-Chip ISBN: 1138117943 ISBN-13(EAN): 9781138117945 Издательство: Taylor&Francis Рейтинг: Цена: 73490.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание:
A presentation of state-of-the-art approaches from an industrial applications perspective, Communication Architectures for Systems-on-Chip shows professionals, researchers, and students how to attack the problem of data communication in the manufacture of SoC architectures.
With its lucid illustration of current trends and research improving the performance, quality, and reliability of transactions, this is an essential reference for anyone dealing with communication mechanisms for embedded systems, systems-on-chip, and multiprocessor architectures--or trying to overcome existing limitations. Exploring architectures currently implemented in manufactured SoCs--and those being proposed--this book analyzes a wide range of applications, including:
Well-established communication buses
Less common networks-on-chip
Modern technologies that include the use of carbon nanotubes (CNTs)
Optical links used to speed up data transfer and boost both security and quality of service (QoS)
The book's contributors pay special attention to newer problems, including how to protect transactions of critical on-chip information (personal data, security keys, etc.) from an external attack. They examine mechanisms, revise communication protocols involved, and analyze overall impact on system performance.
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