3D Interconnect Architectures for Heterogeneous Technologies, Bamberg

Автор: Chong Leong, Gan, Chen-Yu, Huang
Название: Interconnect Reliability in Advanced Memory Device Packaging
ISBN: 3031267079 ISBN-13(EAN): 9783031267079
Издательство: Springer
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Цена: 186330.00 T
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Описание: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

Автор: Hugo Veenstra; John R. Long
Название: Circuit and Interconnect Design for RF and High Bit-rate Applications
ISBN: 9048177502 ISBN-13(EAN): 9789048177509
Издательство: Springer
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Цена: 130590.00 T
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Описание: Realizing maximum performance from high bit-rate and RF circuits requires close attention to IC technology, circuit-to-circuit interconnections (i.e., the `interconnect`) and circuit design. Many practical circuit examples are included to demonstrate the interplay between technology, interconnect and circuit design.

Автор: Bamberg
Название: 3D Interconnect Architectures for Heterogeneous Technologies
ISBN: 3030982289 ISBN-13(EAN): 9783030982287
Издательство: Springer
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Цена: 111790.00 T
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Описание: This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.

Автор: Ian O`Connor; Gabriela Nicolescu
Название: Integrated Optical Interconnect Architectures for Embedded Systems
ISBN: 1489992049 ISBN-13(EAN): 9781489992048
Издательство: Springer
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Цена: 113180.00 T
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Описание: This book highlights current research in optical interconnect technologies and architectures. Particular emphasis is given to the ways photonic components are assembled into architectures to address the needs of data-intensive on-chip communication.

Автор: Michel Dubois; Shreekant S. Thakkar
Название: Cache and Interconnect Architectures in Multiprocessors
ISBN: 0792390741 ISBN-13(EAN): 9780792390749
Издательство: Springer
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Цена: 139710.00 T
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Описание: Cache And Interconnect Architectures In Multiprocessors Eilat, Israel May 25-261989 Michel Dubois UniversityofSouthernCalifornia Shreekant S. Thakkar SequentComputerSystems The aim of the workshop was to bring together researchers working on cache coherence protocols for shared-memory multiprocessors with various interconnect architectures. Shared-memory multiprocessors have become viable systems for many applications. Bus- based shared-memory systems (Eg. Sequent's Symmetry, Encore's Multimax) are currently limited to 32 processors. The fIrst goal of the workshop was to learn about the performance ofapplications on current cache-based systems. The second goal was to learn about new network architectures and protocols for future scalable systems. These protocols and interconnects would allow shared-memory architectures to scale beyond current imitations. The workshop had 20 speakers who talked about their current research. The discussions were lively and cordial enough to keep the participants away from the wonderful sand and sun for two days. The participants got to know each other well and were able to share their thoughts in an informal manner. The workshop was organized into several sessions. The summary of each session is described below. This book presents revisions of some of the papers presented at the workshop.

Автор: Pasricha, Sudeep
Название: On-Chip Communication Architectures,-
ISBN: 012373892X ISBN-13(EAN): 9780123738929
Издательство: Elsevier Science
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Цена: 75220.00 T
Наличие на складе: Поставка под заказ.
Описание: System-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. This book deals with the concepts, research and trends in on-chip communication architecture design. It provides readers with a comprehensive survey of the standards for on-chip communication architectures.

Автор: Coppola, Marcello
Название: Design of Cost-Efficient Interconnect Processing Units
ISBN: 1420044710 ISBN-13(EAN): 9781420044713
Издательство: Taylor&Francis
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Цена: 122490.00 T
Наличие на складе: Нет в наличии.

Автор: Ayan Mandal; Sunil P. Khatri; Rabi Mahapatra
Название: Source-Synchronous Networks-On-Chip
ISBN: 1493948172 ISBN-13(EAN): 9781493948178
Издательство: Springer
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Цена: 95770.00 T
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Описание: This book describes novel methods for network-on-chip (NoC) design, using source-synchronous high-speed resonant clocks. It provides circuit-level details of the NoC and includes architectural simulations of the NoC.

Автор: Konstantin Moiseev; Avinoam Kolodny; Shmuel Wimer
Название: Multi-Net Optimization of VLSI Interconnect
ISBN: 149394262X ISBN-13(EAN): 9781493942626
Издательство: Springer
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Цена: 87060.00 T
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Описание: This book examines design and migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects, covering scaling-dependent models for interconnect power, interconnect delay and crosstalk noise, plus design optimization problems.

Автор: Sandeep Saini
Название: Low Power Interconnect Design
ISBN: 1461413222 ISBN-13(EAN): 9781461413226
Издательство: Springer
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Цена: 102480.00 T
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Описание: As well as offering practical solutions for delay and power reduction for on-chip interconnects and buses, this book provides in-depth descriptions of the problem of signal delay and extra power consumption and possible solutions for delays and glitches.

Автор: Tae-Kyu Lee; Thomas R. Bieler; Choong-Un Kim; Hong
Название: Fundamentals of Lead-Free Solder Interconnect Technology
ISBN: 1461492653 ISBN-13(EAN): 9781461492658
Издательство: Springer
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Цена: 121890.00 T
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Описание: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.

Автор: Ayan Mandal; Sunil P. Khatri; Rabi Mahapatra
Название: Source-Synchronous Networks-On-Chip
ISBN: 1461494044 ISBN-13(EAN): 9781461494041
Издательство: Springer
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Цена: 113190.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book describes novel methods for network-on-chip (NoC) design, using source-synchronous high-speed resonant clocks. It provides circuit-level details of the NoC and includes architectural simulations of the NoC.