Next-Generation High-Speed Satellite Interconnect, Nannipieri

Автор: Nannipieri Pietro, Dinelli Gianmarco, Dello Sterpaio Luca
Название: Next-Generation High-Speed Satellite Interconnect: Disclosing the Spacefibre Protocol - A System Perspective
ISBN: 3030770435 ISBN-13(EAN): 9783030770433
Издательство: Springer
Цена: 46570.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book introduces the space community to the novel SpaceFibre protocol, developed under the guidance of the European Space Agency (ESA) as the forthcoming, high speed (Gbps) communication protocol for satellite on-board communication.

Автор: Stephen H. Hall
Название: High-Speed Digital System Design: A Handbook of Interconnect Theory and Design Practices
ISBN: 0471360902 ISBN-13(EAN): 9780471360902
Издательство: Wiley
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Цена: 146730.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: An understanding of high speed interconnect phenomena is necessary for modern designs such as routing and layout of computer motherboards. Computers have reached speeds where digital design must provide for these effects. The problem is that most engineers active today have not been trained in this subject.

Автор: Hugo Veenstra; John R. Long
Название: Circuit and Interconnect Design for RF and High Bit-rate Applications
ISBN: 9048177502 ISBN-13(EAN): 9789048177509
Издательство: Springer
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Цена: 130590.00 T
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Описание: Realizing maximum performance from high bit-rate and RF circuits requires close attention to IC technology, circuit-to-circuit interconnections (i.e., the `interconnect`) and circuit design. Many practical circuit examples are included to demonstrate the interplay between technology, interconnect and circuit design.

Автор: Bamberg
Название: 3D Interconnect Architectures for Heterogeneous Technologies
ISBN: 3030982289 ISBN-13(EAN): 9783030982287
Издательство: Springer
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Цена: 111790.00 T
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Описание: This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.

Автор: Ayan Mandal; Sunil P. Khatri; Rabi Mahapatra
Название: Source-Synchronous Networks-On-Chip
ISBN: 1493948172 ISBN-13(EAN): 9781493948178
Издательство: Springer
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Цена: 95770.00 T
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Описание: This book describes novel methods for network-on-chip (NoC) design, using source-synchronous high-speed resonant clocks. It provides circuit-level details of the NoC and includes architectural simulations of the NoC.

Автор: Konstantin Moiseev; Avinoam Kolodny; Shmuel Wimer
Название: Multi-Net Optimization of VLSI Interconnect
ISBN: 149394262X ISBN-13(EAN): 9781493942626
Издательство: Springer
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Цена: 87060.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book examines design and migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects, covering scaling-dependent models for interconnect power, interconnect delay and crosstalk noise, plus design optimization problems.

Автор: Ian O`Connor; Gabriela Nicolescu
Название: Integrated Optical Interconnect Architectures for Embedded Systems
ISBN: 1489992049 ISBN-13(EAN): 9781489992048
Издательство: Springer
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Цена: 113180.00 T
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Описание: This book highlights current research in optical interconnect technologies and architectures. Particular emphasis is given to the ways photonic components are assembled into architectures to address the needs of data-intensive on-chip communication.

Автор: Sandeep Saini
Название: Low Power Interconnect Design
ISBN: 1461413222 ISBN-13(EAN): 9781461413226
Издательство: Springer
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Цена: 102480.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: As well as offering practical solutions for delay and power reduction for on-chip interconnects and buses, this book provides in-depth descriptions of the problem of signal delay and extra power consumption and possible solutions for delays and glitches.

Автор: Tae-Kyu Lee; Thomas R. Bieler; Choong-Un Kim; Hong
Название: Fundamentals of Lead-Free Solder Interconnect Technology
ISBN: 1461492653 ISBN-13(EAN): 9781461492658
Издательство: Springer
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Цена: 121890.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.

Автор: Christopher Lyle Borst; William N. Gill; Ronald J.
Название: Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
ISBN: 1461354242 ISBN-13(EAN): 9781461354246
Издательство: Springer
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Цена: 130610.00 T
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Описание: As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects.

Автор: Mustafa Celik; Larry Pileggi; Altan Odabasioglu
Название: IC Interconnect Analysis
ISBN: 1475776748 ISBN-13(EAN): 9781475776744
Издательство: Springer
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Цена: 130430.00 T
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Описание: As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components.

Автор: Andreas Hansson; Kees Goossens
Название: On-Chip Interconnect with aelite
ISBN: 1461427118 ISBN-13(EAN): 9781461427117
Издательство: Springer
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Цена: 121890.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a comprehensive description and implementation methodology for the Philips/NXP Aethereal/aelite Network-on-Chip. It uses real-world illustrations in the form of case studies and examples that communicate the power of the methods presented.