Proceedings of ASME 2021 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference (IDETC-CIE2021) (Volume 11): Volume 11: 15th International Conference on Micro- and Nanosystems (MNS),
Автор: ASME Название: Print Proceedings of the ASME 2016 Conference on Information Storage and Processing Systems (ISPS2016) ISBN: 0791849880 ISBN-13(EAN): 9780791849880 Издательство: Mare Nostrum (Eurospan) Рейтинг: Цена: 145990.00 T Наличие на складе: Невозможна поставка. Описание: A printed collection of 68 full-length, peer-reviewed technical papers. Topics include Tribology, Head/Media Interface, Spindle Motor and Acoustics, Optical Storage and Future Technologies.
Название: Print Proceedings of the ASME 2017 26th Annual Conference on Information Storage and Processing Systems (ISPS2017): Volume 1 ISBN: 0791858103 ISBN-13(EAN): 9780791858103 Издательство: Mare Nostrum (Eurospan) Рейтинг: Цена: 111810.00 T Наличие на складе: Невозможна поставка. Описание: A printed collection of 49 full-length, peer-reviewed technical papers. Topics include: Tribology, Head/Media Interface; Actuator/Suspension and Sensors; Servo Control Technology; Shock and Flow Induced Vibrations; Spindle Motor and Acoustics; Micro/Nano Technology; Mechatronics, Robotics, and Automation; and Imaging/printing Technologies and Consumer Electronics.
Название: Proceedings of the ASME 2021 3rd International Offshore Wind Technical Conference (IOWTC2021) ISBN: 0791884767 ISBN-13(EAN): 9780791884768 Издательство: Mare Nostrum (Eurospan) Рейтинг: Цена: 120120.00 T Наличие на складе: Нет в наличии. Описание: Presents 26 papers from the ASME 2021 3rd International Offshore Wind Technical Conference, featuring subjects such as Aero-Hydro Modeling, Floating Concepts, Metocean Mooring and Foundation Design, Offshore Wind Turbine Drivetrains, Structural Analysis Design, and Operational Challenges and REFOS.
Название: Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) ISBN: 079188550X ISBN-13(EAN): 9780791885505 Издательство: Mare Nostrum (Eurospan) Рейтинг: Цена: 212520.00 T Наличие на складе: Нет в наличии. Описание: Explores the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Presents 76 papers from the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.