Industrial Applications of Adhesives: 1st International Conference on Industrial Applications of Adhesives, Silva Lucas F. M. Da, Adams Robert D., Sato Chiaki

Автор: Silva Lucas F. M. Da, Adams Robert D., Sato Chiaki
Название: Industrial Applications of Adhesives: 1st International Conference on Industrial Applications of Adhesives
ISBN: 9811567662 ISBN-13(EAN): 9789811567667
Издательство: Springer
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Цена: 102480.00 T
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Описание: This book gathers selected papers presented at the 1st International Conference on Industrial Applications of Adhesives 2020 (IAA 2020). Providing a review of the state-of the art in industrial applications of adhesives, the book serves as a valuable reference resource for researchers and graduate students interested in adhesive bonding.

Автор: da Silva
Название: 2nd International Conference on Industrial Applications of Adhesives 2022
ISBN: 3031111494 ISBN-13(EAN): 9783031111495
Издательство: Springer
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Цена: 186330.00 T
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Описание: This book provides selected papers presented at the 2nd International Conference on Industrial Applications of Adhesives 2022, held in Carvoeiro, Portugal, 3-4 March 2022. The volume focuses on applications of adhesive bonding in the industry such as automotive, aeronautic, railway, marine, energy, and electronics. A wide range of topics like adhesion assessment between polymers and metals, pressure sensitive adhesives, adhesive bonding process optimization, civil applications, adhesive joints in composite materials and elastic adhesives are covered. The book presents the latest results and innovations in this field, useful for adhesive producers and adhesive users.

Автор: Jawaid Mohammad, Khan Tanveer Ahmed, Nasir Mohammed
Название: Eco-Friendly Adhesives for Wood and Natural Fiber Composites: Characterization, Fabrication and Applications
ISBN: 9813347481 ISBN-13(EAN): 9789813347489
Издательство: Springer
Цена: 204970.00 T
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Описание: This book provides an overview of eco-friendly resins and their composite materials covering their synthesis, sources, structures and properties for different industrial applications to support the ongoing research and development in eco-friendly and renewable commercial products.

Автор: Wong, C. P. Li, Yi Lu, Daniel
Название: Electrical conductive adhesives with nanotechnologies
ISBN: 0387887822 ISBN-13(EAN): 9780387887821
Издательство: Springer
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Цена: 148020.00 T
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Описание: Offers an overview of electronic packaging, and discusses the various adhesives options, including lead-free solder and Electrically Conductive Adhesives. This title discusses how nano techniques can be applied to conductive adhesives, including research and development of nano component adhesives/nano component films.

Автор: Licari James J., Swanson Dale W.
Название: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability
ISBN: 0128103701 ISBN-13(EAN): 9780128103708
Издательство: Elsevier Science
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Цена: 154960.00 T
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Описание: Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devices. Bio-compatible adhesives for implantable medical devices. Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.

Автор: Alam M. O., Bailey C., Bailey Christopher
Название: Advanced Adhesives in Electronics: Materials, Properties and Applications
ISBN: 0081017324 ISBN-13(EAN): 9780081017326
Издательство: Elsevier Science
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Цена: 157200.00 T
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Описание: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.

Автор: Irving Skeist
Название: Handbook of Adhesives
ISBN: 1461280192 ISBN-13(EAN): 9781461280194
Издательство: Springer
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Цена: 113190.00 T
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Автор: K.J. Saunders
Название: Organic Polymer Chemistry
ISBN: 9401070318 ISBN-13(EAN): 9789401070317
Издательство: Springer
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Цена: 95770.00 T
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Описание: This book deals with the organic chemistry of polymers which find tech- nological use as adhesives, fibres, paints, plastics and rubbers.

Автор: K. L. Mittal, Thomas Bahners
Название: Textile Finishing: Recent Developments and Future Trends
ISBN: 1119426766 ISBN-13(EAN): 9781119426769
Издательство: Wiley
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Цена: 200590.00 T
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Описание: Textiles have been historically and traditionally used to make clothes, but even in ancient times there were technical textiles for making sails, tents, etc. Today, technical textiles are used in various industries for a host of purposes and applications. Recently, there have been exciting developments on various fronts in the textile field to impart novel and innovative functionalities to textiles, e.g., easy-to-clean or dirt-repellent, flame retardancy, anti-bacterial, and fog-harvesting properties, to name a few. Also, textiles for electronics based on graphene, CNTs and other nanomaterials, conductive textiles, textiles for sensor function,   textile-fixed catalysts,  textiles for batteries and energy storage, textiles as substrates for tissue engineering, and textiles for O/W separation have appeared in the literature. All this has been possible through adopting novel ways for finishing textiles, e.g., by appropriate surface modification techniques, and utilizing biomimetic concepts borrowed from nature. This unique book entitled “Textile Finishing: Recent Developments and Future Trends” is divided into four parts: Part 1: Recent Developments/Current Challenges in Textile Finishing; Part 2: Surface Modification Techniques for Textiles; Part 3: Innovative Functionalities of Textiles; Part 4: Fiber-Reinforced Composites. The topics covered include: Antimicrobial textile finishes; flame retardant textile finishing; “self-cleaning” or easy-to-clean textiles; metallization of textiles; atmospheric pressure plasma, and uv-based photochemical surface modification of textiles; tunable wettability of textiles; 3D textile structures for fog harvesting; textile-fixed catalysts; medical textiles as substrates for tissue engineering; and fiber-reinforced “green” or “greener” biocomposites and the relevance of fiber/matrix adhesion.

Автор: Jan W. Gooch
Название: Analysis and Deformulation of Polymeric Materials
ISBN: 1475770952 ISBN-13(EAN): 9781475770957
Издательство: Springer
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Цена: 174150.00 T
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Автор: K. J. Saunders
Название: Organic Polymer Chemistry
ISBN: 9401725063 ISBN-13(EAN): 9789401725064
Издательство: Springer
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Цена: 95770.00 T
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Описание: This book deals with the organic chemistry of polymers which find technological use as adhesives, fibres, paints, plastics and rubbers. In recognition of this situation and because the two aspects of polymer chemistry are often taught separately, this book deals specifically with organic chemistry and topics of physical chemistry have been omitted.

Автор: S.R. Hartshorn
Название: Structural Adhesives
ISBN: 1468477838 ISBN-13(EAN): 9781468477832
Издательство: Springer
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Цена: 121890.00 T
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Описание: Adhesives in general and structural adhesives in particular are the subjects of much academic interest as well as commercial importance. The purpose of Structural Adhesives: Chemistry and Technology is to review the major classes of structural adhesives and the principles of adhesion and bonding as these relate to structural joints.