Carbon Nanotubes for Interconnects: Process, Design and Applications, Todri-Sanial Aida, Dijon Jean, Maffucci Antonio
Автор: Todri-Sanial Название: Carbon Nanotubes for Interconnects ISBN: 3319297449 ISBN-13(EAN): 9783319297446 Издательство: Springer Рейтинг: Цена: 107130.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Автор: Rohit Dhiman; Rajeevan Chandel Название: Compact Models and Performance Investigations for Subthreshold Interconnects ISBN: 8132229975 ISBN-13(EAN): 9788132229971 Издательство: Springer Рейтинг: Цена: 87060.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques.
Автор: Sathyakam P. Uma, Mallick Partha Sharathi Название: Design and CrossTalk Analysis in Carbon Nanotube Interconnects ISBN: 9811588872 ISBN-13(EAN): 9789811588877 Издательство: Springer Цена: 111790.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Starting with a background of carbon nanotubes and interconnects, this book details various aspects of CNT interconnect models, the design metrics of CNT interconnects, crosstalk analysis of recently proposed CNT interconnect structures, and geometries.
Автор: Hartmut Grabinski Название: Interconnects in VLSI Design ISBN: 1461369541 ISBN-13(EAN): 9781461369547 Издательство: Springer Рейтинг: Цена: 139750.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999.
Автор: Brajesh Kumar Kaushik; Manoj Kumar Majumder Название: Carbon Nanotube Based VLSI Interconnects ISBN: 8132220463 ISBN-13(EAN): 9788132220466 Издательство: Springer Рейтинг: Цена: 56590.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects.
Автор: B.K. Kaushik; V. Ramesh Kumar; Amalendu Patnaik Название: Crosstalk in Modern On-Chip Interconnects ISBN: 9811007993 ISBN-13(EAN): 9789811007996 Издательство: Springer Рейтинг: Цена: 60940.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: The book provides accurate FDTDmodels for on-chip interconnects, covering most recent advancements inmaterials and design. It presents thestructure, properties, and characteristics of graphene based on-chipinterconnects and the FDTD modeling of Cu based on-chip interconnects.
Автор: Philippe Lalanne; Pierre Chavel Название: Perspectives for Parallel Optical Interconnects ISBN: 3642492665 ISBN-13(EAN): 9783642492662 Издательство: Springer Рейтинг: Цена: 79190.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Metakides Table of contents 1 Perspectives for parallel optical interconnects: introduction . 1 Optical Interconnects and ESPRIT BRA WOIT . 3 Schemes for parallel optical interconnects . 1 Passive interconnect components 2 Free space interconnects . 1 Introduction: 3D optical interconnects . 2 Two Qasic interconnect setups .
Автор: Michel S. Nakhla; Q.J. Zhang Название: Modeling and Simulation of High Speed VLSI Interconnects ISBN: 0792394410 ISBN-13(EAN): 9780792394419 Издательство: Springer Рейтинг: Цена: 121110.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area.
Автор: Ethiopia Enideg Nigussie Название: Variation Tolerant On-Chip Interconnects ISBN: 1489990860 ISBN-13(EAN): 9781489990860 Издательство: Springer Рейтинг: Цена: 121110.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. It is for anyone concerned with the design of next generation, high-performance electronics systems.
Автор: Rohit Dhiman; Rajeevan Chandel Название: Compact Models and Performance Investigations for Subthreshold Interconnects ISBN: 8132221311 ISBN-13(EAN): 9788132221319 Издательство: Springer Рейтинг: Цена: 104480.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques.
Reveals Innovative Research on BN Nanotubes and Nanosheets
Nanotubes and Nanosheets: Functionalization and Applications of Boron Nitride and Other Nanomaterials is the first book devoted to nanotubes and nanosheets made of boron nitride (BN). It shows how the properties of BN nanotubes and nanosheets have led to many exciting applications where carbon (C) materials cannot be used, including high-temperature metal-ceramic-based composites, substrates for graphene and other semiconducting layers in electronic devices, reusable absorbents for oil and other contaminants, dry solid lubricants, and biomedical applications.
Researchers working on various aspects of BN nanomaterials share their knowledge and current work on the applications of BN nanotubes and nanosheets. They describe numerous applications, including BN nanotube-reinforced metal-ceramic-based composites, field emission, desalination, cleanup of oil spillages, biosensing and bioimaging, drug delivery, biomedical applications, and energy storage using BCN and TiO2 nanorods and nanosheets as electrode materials. The book also covers C and other nanotubes and nanosheets to give readers a broad view of the latest nanomaterials research.
Казахстан, 010000 г. Астана, проспект Туран 43/5, НП2 (офис 2) ТОО "Логобук" Тел:+7 707 857-29-98 ,+7(7172) 65-23-70 www.logobook.kz
