Analysis of Grounding and Bonding Systems, Mitolo, Massimo
Автор: Morrison Ralph Название: Grounding and Shielding ISBN: 111918374X ISBN-13(EAN): 9781119183747 Издательство: Wiley Рейтинг: Цена: 102380.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Applies basic field behavior in circuit design and demonstrates how it relates to grounding and shielding requirements and techniques in circuit design This book connects the fundamentals of electromagnetic theory to the problems of interference in all types of electronic design.
Автор: Gouda Ossama Название: Optimum Design of Grounding System of High Voltage Substatio ISBN: 3844314318 ISBN-13(EAN): 9783844314311 Издательство: Неизвестно Рейтинг: Цена: 106930.00 T Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: Jan A. Dziuban Название: Bonding in Microsystem Technology ISBN: 9048171512 ISBN-13(EAN): 9789048171514 Издательство: Springer Рейтинг: Цена: 174130.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice.
Автор: Md. Abdus Salam; Quazi M. Rahman Название: Power Systems Grounding ISBN: 9811004447 ISBN-13(EAN): 9789811004445 Издательство: Springer Рейтинг: Цена: 130610.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This book provides electrical and electronic engineering undergraduate and graduate students and trainees with practical information on grounding-system parameters, and on different methods for measuring soil resistivity and ground resistance.
"Sound earthing & grounding of the electrical installation is the fundamental requirement for safe and reliable operation. There is a lot of misconception among practicing engineers (both design and field) on this topic. Study of this application guide will bring clarity to the reader on this topic.
Earthing methods for different applications like EHV Switchyard, MV and LV systems and earthing application to special areas like Solar farms, GIS terminations, C&I (Control & Instrumentation) systems in power and industrial plants are covered. Remarks on mis-interpretation of IE rules are made.
The reader will understand why different grounding methods are adopted at different voltage levels. Relationship between Grounding and Transformer Ampere Turns Balance theory is clearly brought out which is the cornerstone of grounding exercise. Features of ungrounded and grounded systems are covered in detail including demystification of zig zag connection. Ready to use spread sheets for sizing of NGT/NGR are given.
Supported by copious illustrations from field experience, fundamental concepts of grounding are explained by solving problems of gradually increasing complexity.
Various practices adopted for Neutral grounding of generator are described.
Students will tremendously benefit by studying this guide as it combines theory with lot of practical examples. He/She will acquire the necessary skills upfront needed by industry.
The design engineer or consultants will find the guide very useful to perform optimum design.
Origin of many nuisance tripping or power quality issues is poor earthing/grounding. The practicing and field engineers will be able to address many of the problems encountered at site due to faulty earthing and grounding
Автор: Preeti S Chauhan; Anupam Choubey; ZhaoWei Zhong; M Название: Copper Wire Bonding ISBN: 1493953494 ISBN-13(EAN): 9781493953493 Издательство: Springer Рейтинг: Цена: 95770.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Copper wire bonding is now replacing gold across the electronics industry, but its metallurgical aspects are highly specialized. This guide combines comparative metallurgical data with full coverage of the methodology and the latest technical innovations.
Автор: Gouda Osama El-Sayed Название: Design Parameters of Electrical Network Grounding Systems ISBN: 1522538534 ISBN-13(EAN): 9781522538530 Издательство: Mare Nostrum (Eurospan) Рейтинг: Цена: 228230.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: As the demand for efficient energy sources continues to grow around the globe, electrical systems are becoming more essential to meet these increased needs. As these systems are being utilized more frequently, it becomes imperative to find ways of optimizing their overall function. Design Parameters of Electrical Network Grounding Systems is a critical scholarly resource that examines safe grounding designs of electrical networks. Featuring coverage on a broad range of topics such as cathodic protection of grounding grids, grounding connections, and soil resistivity evaluation, this book is geared towards academicians, practitioners, and researchers seeking current research on electrical networks.
Автор: Luc Steels; Manfred Hild Название: Language Grounding in Robots ISBN: 1493901842 ISBN-13(EAN): 9781493901845 Издательство: Springer Рейтинг: Цена: 102480.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: The book explores the use of language games for structuring situated dialogues in which contextualized language communication and language acquisition can take place.
Автор: Stockin David Название: McGraw-Hills NEC 2014 Grounding and Earthing Handbook ISBN: 0071800654 ISBN-13(EAN): 9780071800655 Издательство: McGraw-Hill Рейтинг: Цена: 60620.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: The most complete guide to the grounding and earthing requirements of the 2014 National Electrical Code
Автор: Marin Alexe; Ulrich G?sele Название: Wafer Bonding ISBN: 3642059155 ISBN-13(EAN): 9783642059155 Издательство: Springer Рейтинг: Цена: 217670.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off.
Название: Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) ISBN: 9811201110 ISBN-13(EAN): 9789811201110 Издательство: World Scientific Publishing Рейтинг: Цена: 1309440.00 T Наличие на складе: Невозможна поставка. Описание: Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
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