Автор: John J. Burke Название: Risk and Failure Analysis for Improved Performance and Reliability ISBN: 1468478133 ISBN-13(EAN): 9781468478136 Издательство: Springer Рейтинг: Цена: 104480.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: The Army Materials and Mechanics Research Center of Water- town, Massachusetts in cooperation with the Materials Science Group of the Department of Chemical Engineering and Materials Science of Syracuse University has conducted the Sagamore Army Materials Research Conference since 1954.
Автор: Harry Wirth, Karl-Anders Weis, Cornelia Wiesmeier Название: Photovoltaic Modules: Technology and Reliability ISBN: 3110348276 ISBN-13(EAN): 9783110348279 Издательство: Walter de Gruyter Цена: 185890.00 T Наличие на складе: Нет в наличии. Описание: Photovoltaic Modules: Technology and Reliability provides unique insights into concepts, material design strategies, manufacturing techniques, quality and service life analysis of wafer-based photovoltaic modules. Taking an interdisciplinary approach, the authors focus on two main topics. Part I – Crystalline Silicone Module Technology offers photovoltaics fundamentals: solar cell properties, module design, materials and production, basic module characterization, module power as well as efficiency and module performance. Part II, on the other hand, illustrates the state-of-the-art of module reliability by characterization of modules and degradation effects, examination of PV-Module loads, accelerated aging tests as well as reliability testing of materials and modules. A separate chapter is dedicated to PV module and component certification.
Автор: Evans John W., Kwon Dong-il, Engelmaier Werner Название: A Guide to Lead-free Solders / Physical Metallurgy and Reliability ISBN: 1846283094 ISBN-13(EAN): 9781846283093 Издательство: Springer Рейтинг: Цена: 116410.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2002/96/EC on Waste Electrical and Electronic Equipment will require all companies doing business in the EU to transition to lead-free. Compliance with forthcoming lead-free regulations will ultimately fall to individual companies and the engineers responsible for design and prod- tion of electronic products and they must be prepared with adequate knowledge of the materials that are leading candidates and they must be prepared to fill the gaps in the data base for their own products. Research worldwide over the past 10 years has produced data and direction for choosing an alloy to substitute for near-eutectic SnPb alloys. This book will provide a valuable resource for engineers involved in the transition to products. Basic theory is presented on the physical metallurgy of soldering technology including elements of assembly, surface finishes and solder-paste technology, wetting and solidification, microstructural instability and intermetallic c- pounds and mechanical, creep and fatigue behavior. Techniques for measuring and testing are discussed and data on SnPb and various lead-free solders are presented and compared. If lead-free solder data are not available on the re- vant topic, information is presented on near-eutectic SnPb, so as to show where the gaps in knowledge need to be filled.
Автор: Chao Zhang Название: Reliability of Steel Columns Protected by Intumescent Coatings Subjected to Natural Fires ISBN: 3662463784 ISBN-13(EAN): 9783662463789 Издательство: Springer Рейтинг: Цена: 93160.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This thesis studied the effect of aging of intumescent coatings (ICs) on the reliability of protected steel columns in fire condition and developed a probabilistic approach to assess the service life of ICs applied on steel columns.
Durability and Reliability of Polymers and Other Materials in Photovoltaic Modules describes the durability and reliability behavior of polymers used in Si-photovoltaic modules and systems, particularly in terms of physical aging and degradation process/mechanisms, characterization methods, accelerated exposure chamber and testing, module level testing and service life prediction. The book compares polymeric materials to traditional materials used in solar applications, explaining the degradation pathways of the different elements of a photovoltaic module, including encapsulant, front sheet, back sheet, wires and connectors, adhesives, sealants and more. The book shows degradation causes and the specific influence this degradation has on materials and overall PV performance.
The book also shows the tests needed for the evaluation of polymer degradation and aging, as well as accelerated tests to aid in materials selection. Demand for photovoltaics continues to grow worldwide, and polymer photovoltaics can offer significantly lower production costs compared to earlier approaches. This has the potential to significantly improve the value proposition of solar energy; however, photovoltaic module lifetime and degradation mechanisms are of significant importance. Providing practical guidance, as well as giving an outlook on the future of materials in photovoltaic applications, the book is the first comprehensive reference work in the area of photovoltaic polymer durability.
Provides comprehensive coverage of photovoltaic polymers, from the fundamental degradation mechanisms to specific case studies of durability and materials failure
Offers practical, actionable information in relation to service life prediction of photovoltaic modules and accelerated testing for materials selection
Includes up-to-date information and interpretation of safety regulations and testing of photovoltaic modules and materials
Автор: Nikolay Reshetov; Valery A. Svetlitsky Название: Statistical Dynamics and Reliability Theory for Mechanical Structures ISBN: 3642536573 ISBN-13(EAN): 9783642536571 Издательство: Springer Рейтинг: Цена: 149060.00 T Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: Mohd N. Tamin; Norhashimah M. Shaffiar Название: Solder Joint Reliability Assessment ISBN: 3319000918 ISBN-13(EAN): 9783319000916 Издательство: Springer Рейтинг: Цена: 121890.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.
Автор: Jorge Eduardo Hurtado Название: Structural Reliability ISBN: 3642535763 ISBN-13(EAN): 9783642535765 Издательство: Springer Рейтинг: Цена: 111790.00 T Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: G.N. Babini; Miroslav Haviar; Pavol Sajgal?k Название: Engineering Ceramics `96: Higher Reliability through Processing ISBN: 9401064482 ISBN-13(EAN): 9789401064484 Издательство: Springer Рейтинг: Цена: 46570.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Proceedings of the NATO Advanced Research Workshop on `Engineering Ceramics `96`, Smolenice Castle, Slovakia, May 12-15, 1996
Автор: R.A. Smith Название: Reliability Assessment of Cyclically Loaded Engineering Structures ISBN: 9401063419 ISBN-13(EAN): 9789401063418 Издательство: Springer Рейтинг: Цена: 46570.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Proceedings of the NATO Advanced Research Workshop, Varna, Bulgaria, June 6-8, 1996
Автор: James W. McCauley; Volker Weiss Название: Materials Characterization for Systems Performance and Reliability ISBN: 1461292530 ISBN-13(EAN): 9781461292531 Издательство: Springer Рейтинг: Цена: 113190.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Thus, the theme of this year`s Thirty-First Conference, "Materials Characterization for Systems Performance and Reliability," was selected to focus on the need and mechanisms to transition from defect interrogation of materials after production to utilization of materials characterization during manufacturing.
Автор: Mohd N. Tamin; Norhashimah M. Shaffiar Название: Solder Joint Reliability Assessment ISBN: 3319343017 ISBN-13(EAN): 9783319343013 Издательство: Springer Рейтинг: Цена: 104480.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.
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