Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018), 

Название: Print Proceedings of the ASME 2017 InterPack Conference (IPACK2017): Volume 1: Heterogeneous Integration: Micro-Systems with Diverse Functionality; Servers of the Future; Structural and Physical Health Monitoring; Energy Conversion & Storage; Transportati
ISBN: 079185809X ISBN-13(EAN): 9780791858097
Издательство: Mare Nostrum (Eurospan)
Рейтинг:
Цена: 246710.00 T
Наличие на складе: Невозможна поставка.
Описание: A printed collection of 88 full-length, peer-reviewed technical papers. Topics include: Heterogeneous Integration; Micro-Systems with Diverse Functionality; Servers of the Future; Structural and Physical Health Monitoring; Energy Conversion and Transportation: Autonomous & Electric Vehicles.

Автор: American Society of Mechanical Engineers
Название: 2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 1
ISBN: 0791855759 ISBN-13(EAN): 9780791855751
Издательство: Mare Nostrum (Eurospan)
Рейтинг:
Цена: 257790.00 T
Наличие на складе: Невозможна поставка.
Описание: This collection of 86 full-length, peer-reviewed technical papers focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS. These proceedings cover the latest research and emerging technologies.

Автор: American Society of Mechanical Engineers
Название: 2013 Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2013): Volume 2
ISBN: 0791855767 ISBN-13(EAN): 9780791855768
Издательство: Mare Nostrum (Eurospan)
Рейтинг:
Цена: 234690.00 T
Наличие на складе: Невозможна поставка.
Описание: This collection of 80 full-length, peer-reviewed technical papers focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS. These proceedings cover the latest research and emerging technologies.

Название: Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)
ISBN: 0791859320 ISBN-13(EAN): 9780791859322
Издательство: Mare Nostrum (Eurospan)
Рейтинг:
Цена: 258720.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: A printed collection of 90 full-length, peer-reviewed technical papers. Topics include Autonomous, Hybrid, and Electric Vehicles; Energy Conversion and Storage; Flexible and Wearable Electronics; Heterogeneous Integration; Photonics and Optics; and Power Electronics.