ASME ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fundamen 9780791856895

Варианты приобретения

Цена: 234690.00T
Кол-во:
о цене
Наличие: Невозможна поставка.

в Мои желания

Автор: ASME
Название: ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fundamen
ISBN: 9780791856895
Издательство: Mare Nostrum (Eurospan)
Классификация:

Материаловедение

ISBN-10: 0791856895
Обложка/Формат: Paperback
Страницы: 698
Вес: 0.00 кг.
Дата издания: 30.07.2015
Серия: Engineering
Язык: English
Размер: 229 x 152
Читательская аудитория: Professional and scholarly
Ключевые слова: Materials science
Рейтинг:
Поставляется из: Англии
Описание: Presents print proceedings of the ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2015): Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales.

ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fundamen, ASME