Electronics Packaging Forum, James E. Morris

Автор: Horowitz
Название: The Art of Electronics
ISBN: 0521809266 ISBN-13(EAN): 9780521809269
Издательство: Cambridge Academ
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Цена: 90810.00 T
Наличие на складе: Заказано в издательстве.
Описание: At long last, here is the thoroughly revised and updated, and long-anticipated, third edition of the hugely successful The Art of Electronics. Widely accepted as the best single authoritative text on electronic circuit design, it will be an indispensable reference and the gold standard for anyone in the field.

Автор: Scherz Paul, Monk Simon
Название: Practical Electronics for Inventors, Fourth Edition
ISBN: 1259587541 ISBN-13(EAN): 9781259587542
Издательство: McGraw-Hill
Рейтинг:
Цена: 40460.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This fully updated, hands-on guide teaches all the electronics skills necessary to become a successful inventor

Автор: Logothetidis Stergios
Название: Handbook of Flexible Organic Electronics: Materials, Manufacturing and Applications
ISBN: 0081014287 ISBN-13(EAN): 9780081014288
Издательство: Elsevier Science
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Цена: 280720.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices.

Автор: James E. Morris
Название: Electronics Packaging Forum
ISBN: 9401066817 ISBN-13(EAN): 9789401066815
Издательство: Springer
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Цена: 81050.00 T
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Автор: Heinz Nixdorf Museums Forum GmbH HNF; Friedrich L.
Название: Origins and Foundations of Computing
ISBN: 3642425631 ISBN-13(EAN): 9783642425639
Издательство: Springer
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Цена: 37260.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The Heinz Nixdorf Museum Forum (HNF) is the world`s largest c- puter museum and is dedicated to portraying the past, present and future of information technology. To supplement a planned new exhibit on "Software and Inform- ics" at the HNF, the idea arose of recording the history of informatics in an accompanying publication.

Автор: Frank Riley; Electronic Packaging and Production
Название: The Electronics Assembly Handbook
ISBN: 3662131633 ISBN-13(EAN): 9783662131633
Издательство: Springer
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Цена: 113190.00 T
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Описание: The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly.

Автор: Jennie Hwang
Название: Solder Paste in Electronics Packaging
ISBN: 0442013531 ISBN-13(EAN): 9780442013530
Издательство: Springer
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Цена: 97820.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Aims to provide a working understanding of the latest solder paste principles and applications, enabling engineers to take advantage of current surface mount technology. Coverage includes basic technologies, application techniques, reliability and solutions to specific problems.

Автор: R.R. Tummala; Marija Kosec; W.K. Jones; Darko Bela
Название: Electronic Packaging for High Reliability, Low Cost Electronics
ISBN: 0792352181 ISBN-13(EAN): 9780792352181
Издательство: Springer
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Цена: 204040.00 T
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Описание: Integrated circuits require fresh packaging techniques if the devices are to remain within cost and size constraints. This volume addresses new hermetic packaging, materials for thermal management and assembly, and components that integrate multiple functions while retaining previous high levels of reliability.

Автор: Jennie S. Hwang
Название: Solder Paste in Electronics Packaging
ISBN: 940116052X ISBN-13(EAN): 9789401160520
Издательство: Springer
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Цена: 46570.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech- nology.

Автор: Bernard S. Matisoff
Название: Handbook Of Electronics Packaging Design and Engineering
ISBN: 9401170495 ISBN-13(EAN): 9789401170499
Издательство: Springer
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Цена: 46570.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The Handbook of Electronics Packaging Design and Engineering has been writ- ten as a reference source for use in the packaging design of electronics equip- ment. The judicious use of uniform design practices will realize the following economies and equipment improvements: * Economics of design.

Автор: Tour, J.M.
Название: Molecular Electronics. Commercial Insights, Chemistry, Devices, Arc...
ISBN: 9812383417 ISBN-13(EAN): 9789812383419
Издательство: World Scientific Publishing
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Цена: 61250.00 T
Наличие на складе: Невозможна поставка.
Описание: An in-depth discussion of molecular electronics. It includes a detailed synthetic chemistry treasure chest; protocols of self-assembling routes for bottom-up fabrication atop silicon platforms; representative current-voltage and memory readouts from molecular devices; and more.

Автор: Klauk
Название: Organic Electronics II: More Materials and Applications
ISBN: 3527326472 ISBN-13(EAN): 9783527326471
Издательство: Wiley
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Цена: 139340.00 T
Наличие на складе: Поставка под заказ.
Описание: * Bringing together experts from academic and industrial research institutes, this handbook and ready reference offers a joint perspective on the latest developments in organic electronics, thus providing the essential knowledge for readers from both sectors.