Chemical-Mechanical Planarization of Semiconductor Materials, M.R. Oliver

Автор: Kumar
Название: Science and Technology of Chemical Mechanical Planarization (CMP)
ISBN: 1605111309 ISBN-13(EAN): 9781605111308
Издательство: Cambridge Academ
Рейтинг:
Цена: 108770.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Автор: Jianfeng Luo; David A. Dornfeld
Название: Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
ISBN: 364206115X ISBN-13(EAN): 9783642061158
Издательство: Springer
Рейтинг:
Цена: 194730.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example.

Автор: Suryadevara Babu
Название: Advances in Chemical Mechanical Planarization (CMP)
ISBN: 0081001657 ISBN-13(EAN): 9780081001653
Издательство: Elsevier Science
Рейтинг:
Цена: 234680.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. . This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. . Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction.