Thermal Management for LED Applications, Clemens J.M. Lasance; Andr?s Poppe
Автор: Vollmer Название: Infrared Thermal Imaging - Fundamentals, Research and Applications ISBN: 3527413510 ISBN-13(EAN): 9783527413515 Издательство: Wiley Рейтинг: Цена: 191080.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This new up-to-date edition of the successful handbook and ready reference retains the proven concept of the first, covering basic and advanced methods and applications in infrared imaging from two leading expert authors in the field.
Автор: Alexander Clemm; Ralf Wolter Название: Advances in Network-Embedded Management and Applications ISBN: 1489989730 ISBN-13(EAN): 9781489989734 Издательство: Springer Рейтинг: Цена: 130590.00 T Наличие на складе: Есть у поставщика Поставка под заказ.
Автор: Alfred Olivier Hero; David Casta??n; Doug Cochran; Название: Foundations and Applications of Sensor Management ISBN: 1441939113 ISBN-13(EAN): 9781441939111 Издательство: Springer Рейтинг: Цена: 174130.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This book covers control theory signal processing and relevant applications in a unified manner. It introduces the area, takes stock of advances, and describes open problems and challenges in order to advance the field.
Автор: Tritt Terry M. Название: Thermal Conductivity / Theory, Properties, and Applications ISBN: 0306483270 ISBN-13(EAN): 9780306483271 Издательство: Springer Рейтинг: Цена: 204970.00 T Наличие на складе: Невозможна поставка. Описание: It has been almost thirty years since the publication of a book that is entirely dedicated to the theory, description, characterization and measurement of the thermal conductivity of solids. The recent discovery of new materials which possess more complex crystal structures and thus more complicated phonon scattering mechanisms have brought innovative challenges to the theory and experimental understanding of these new materials. With the development of new and novel solid materials and new measurement techniques, this book will serve as a current and extensive resource to the next generation researchers in the field of thermal conductivity. This book is a valuable resource for research groups and special topics courses (8-10 students), for 1st or 2nd year graduate level courses in Thermal Properties of Solids, special topics courses in Thermal Conductivity, Superconductors and Magnetic Materials, and to researchers in Thermoelectrics, Thermal Barrier Materials and Solid State Physics.
Автор: Wong Basil T., MengГјГ§ Pinar M. Название: Thermal Transport for Applications in Nanomachining ISBN: 3540736050 ISBN-13(EAN): 9783540736059 Издательство: Springer Рейтинг: Цена: 158380.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Nanotechnology remains one of the most active and intriguing research and development areas and the importance of novel devices and systems engineered at the nanoscale is steadily increasing. This book addresses the significant role played by thermal transport in all types of machining processes, considering the various time and length scales relevant from the macro-scale to the nanoscale levels. In particular, it reviews and highlights of thermal transport theories related to "nanomachining," a term loosely defined as the ability to shape, form, or build new structures at the nanoscale (1-100 nm). Beginning with an overview of nanomachining, the monograph introduces the relevant concepts from solid-state physics, thermodynamics, and lattice structures. Attention is then given to the modelling of thermal transport at the nanoscale, including electron-beam propagation, the electronic thermal conduction, and the phonon transport. Simulations of different processes relevant to nanomachining are described in detail. The final chapter of the monograph summarizes the important points and discusses directions for future work to improve the modelling of nanomachining.
Автор: Dean L. Monthei Название: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications ISBN: 0792383648 ISBN-13(EAN): 9780792383642 Издательство: Springer Рейтинг: Цена: 158380.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.
Автор: Dean L. Monthei Название: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications ISBN: 1461373255 ISBN-13(EAN): 9781461373254 Издательство: Springer Рейтинг: Цена: 158380.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.
Автор: Mark Benson Название: The Art of Software Thermal Management for Embedded Systems ISBN: 1493947117 ISBN-13(EAN): 9781493947119 Издательство: Springer Рейтинг: Цена: 87060.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This book introduces Software Thermal Management (STM) as a means to reduce computing system power consumption in order to manage heat, improve component reliability, and increase system safety. Shows software engineers how to avoid generating excessive heat.
The book discusses the emerging topic of comprehensive energy management in electric vehicles from the viewpoint of academia and from the industrial perspective. It provides a seamless coverage of all relevant systems and control algorithms for comprehensive energy management, their integration on a multi-core system and their reliability assurance (validation and test). Relevant European projects contributing to the evolvement of comprehensive energy management in fully electric vehicles are also included.
This volume includes contributions on model based functional safety and fault-tolerant E/E architectures, advanced control making use of external information (from a cloud) as well and thermal management as a central part for energy optimization and finally some aspects on fuel cells.
The second volume (ISBN .....) includes chapters on ECO driving and ECO routing covering different approaches for optimal speed profiles for a given route (mostly interconnecting with cloud data).
Автор: Xingcun Colin Tong Ph.D Название: Advanced Materials for Thermal Management of Electronic Packaging ISBN: 1461427924 ISBN-13(EAN): 9781461427926 Издательство: Springer Рейтинг: Цена: 156720.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.
Автор: Yogendra Joshi; Pramod Kumar Название: Energy Efficient Thermal Management of Data Centers ISBN: 1489987215 ISBN-13(EAN): 9781489987211 Издательство: Springer Рейтинг: Цена: 156720.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: Examining energy flow in today`s data centers, this book gives particular focus to the state-of-the-art thermal management approaches now being implemented across the globe. Future trends in computing hardware and their possible impacts are also examined.
Автор: Mark Benson Название: The Art of Software Thermal Management for Embedded Systems ISBN: 1493902970 ISBN-13(EAN): 9781493902972 Издательство: Springer Рейтинг: Цена: 104480.00 T Наличие на складе: Есть у поставщика Поставка под заказ. Описание: This book introduces Software Thermal Management (STM) as a means to reduce computing system power consumption in order to manage heat, improve component reliability, and increase system safety. Shows software engineers how to avoid generating excessive heat.
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