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LED Packaging Technologies: Principles and Impleme ntation, Lee


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Цена: 116110.00T
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Склад Америка: 191 шт.  
При оформлении заказа до: 2025-08-04
Ориентировочная дата поставки: Август-начало Сентября
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Автор: Lee
Название:  LED Packaging Technologies: Principles and Impleme ntation
ISBN: 9781118881477
Издательство: Wiley
Классификация:
ISBN-10: 1118881478
Обложка/Формат: Hardback
Страницы: 352
Вес: 0.67 кг.
Дата издания: 22.07.2022
Серия: Physics,Electronics & communications engineering
Язык: English
Размер: 250 x 150 x 15
Читательская аудитория: Professional & vocational
Ключевые слова: Physics,Electronics & communications engineering
Основная тема: Electronic Packaging
Ссылка на Издательство: Link
Рейтинг:
Поставляется из: Англии
Описание: FROM LED TO SOLID STATE LIGHTING

A comprehensive and practical reference complete with hands-on exercises and experimental data

In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features.

Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. Theyll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material.

This important book also includes:

  • Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips
  • Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization
  • Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization
  • In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting

Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.


Engineering Electromagnetic Compatibility: Principles, Measurements, Technologies, and Computer Models, 2nd Edition

Автор: W. Prasad Kodali
Название: Engineering Electromagnetic Compatibility: Principles, Measurements, Technologies, and Computer Models, 2nd Edition
ISBN: 0780347439 ISBN-13(EAN): 9780780347434
Издательство: Wiley
Рейтинг:
Цена: 182630.00 T
Наличие на складе: Поставка под заказ.
Описание: "This practical, enhanced second edition will teach you to avoid costly post--design electromagnetic compatibility (EMC) fixes. Once again, V.


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