Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics, Lin

Автор: Todri-Sanial
Название: Carbon Nanotubes for Interconnects
ISBN: 3319297449 ISBN-13(EAN): 9783319297446
Издательство: Springer
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Цена: 107130.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Автор: Gall
Название: Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics — 2009
ISBN: 1107408318 ISBN-13(EAN): 9781107408319
Издательство: Cambridge Academ
Цена: 28510.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Автор: Gall
Название: Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics — 2009
ISBN: 1605111295 ISBN-13(EAN): 9781605111292
Издательство: Cambridge Academ
Рейтинг:
Цена: 103490.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Автор: Oehrlein
Название: Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics
ISBN: 110741315X ISBN-13(EAN): 9781107413153
Издательство: Cambridge Academ
Цена: 28510.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Автор: Carter
Название: Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics — 2004
ISBN: 1107409225 ISBN-13(EAN): 9781107409224
Издательство: Cambridge Academ
Цена: 28510.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Автор: Ethiopia Enideg Nigussie
Название: Variation Tolerant On-Chip Interconnects
ISBN: 1489990860 ISBN-13(EAN): 9781489990860
Издательство: Springer
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Цена: 121110.00 T
Наличие на складе: Есть у поставщика Поставка под заказ.
Описание: This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. It is for anyone concerned with the design of next generation, high-performance electronics systems.