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Integrated Circuit Failure Analysis, Beck

Integrated Circuit Failure Analysis

Автор: Beck
Название:  Integrated Circuit Failure Analysis   (Бек. Анализы отказа интегральной схемы)
Издательство: Wiley
Издательство: John wiley and sons ltd
Классификация:
Электронная техника

ISBN: 0471974013
ISBN-13(EAN): 9780471974017
ISBN: 0-471-97401-3
ISBN-13(EAN): 978-0-471-97401-7
Обложка/Формат: Hardback
Страницы: 190
Вес: 0.432 кг.
Дата издания: 19.01.1998
Серия: Wiley series in quality & reliability engineering
Язык: Eng
Иллюстрации: Index
Размер: 23.75 x 15.62 x 1.52 cm
Читательская аудитория: Postgraduate, research & scholarly
Рейтинг:
Описание: Examines the most important physical and chemical preparative methods and applications in semiconductor device analysis. The main focus of the book is on bipolar and MOS circuits but material is equally pertinent to the analysis of other kinds of components.
Описание: The construction and failure analysis of highly integrated semiconductor components has gained in significance with the explosive growth in the semiconductor industry. Once a subordinate laboratory task, semiconductor failure analysis has now become a discipline in its own right.

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Microelectronics Circuit Analysis and Design

Автор: Neamen Donald A
Название: Microelectronics Circuit Analysis and Design
ISBN: 007128947X ISBN-13(EAN): 9780071289474
Издательство: McGraw-Hill
Цена: 29910 T
Наличие на складе: Поставка под заказ.

Semiconductor Device and Failure Analysis : Using Photon Emission Microscopy

Автор: Wai Kin Chim
Название: Semiconductor Device and Failure Analysis : Using Photon Emission Microscopy
ISBN: 047149240X ISBN-13(EAN): 9780471492405
Издательство: Wiley
Цена: 73330 T
Наличие на складе: Поставка под заказ.
Описание: Fault detection has become increasingly difficult as integrated circuits become more and more complex. Photon Emission Microopy (PEM) is a physical failure analysis technique which locates and identifies faults in integrated circuits.

Schaum`s Outline of Basic Circuit Analysis, Revised Second Edition

Автор: O`Malley John, O`Malley John
Название: Schaum`s Outline of Basic Circuit Analysis, Revised Second Edition
ISBN: 0071756434 ISBN-13(EAN): 9780071756433
Издательство: McGraw-Hill
Цена: 7030 T
Наличие на складе: Поставка под заказ.

Analysis and Design of Analog Integrated Circuits, 4th Edition

Автор: Paul R. Gray
Название: Analysis and Design of Analog Integrated Circuits, 4th Edition
ISBN: 0471321680 ISBN-13(EAN): 9780471321682
Издательство: Wiley
Цена: 53950 T
Наличие на складе: Поставка под заказ.
Описание: The fourth edition features coverage of cutting edge topics-more advanced CMOS device electronics to include short-channel effects, weak inversion and impact ionization. In this resourceful book find: Coverage of state-of-the-art IC processes shows how modern integrated circuits are fabricated, including recent issues like heterojunction bipolar transistors, copper interconnect and low permittivity dielectric materials Comprehensive and unified treatment of bipolar and CMOS circuits helps readers design real-world amplifiers in silicon.

Bipolar and MOS Analog Integrated Circuit Design

Автор: Alan B. Grebene
Название: Bipolar and MOS Analog Integrated Circuit Design
ISBN: 0471430781 ISBN-13(EAN): 9780471430780
Издательство: Wiley
Цена: 62770 T
Наличие на складе: Поставка под заказ.
Описание: A practical, engineering book discussing the most modern and general techniques for designing analog integrated circuits which are not digital (excluding computer circuits). Covers the basics of the devices, manufacturing technology, design procedures, shortcuts, and analytic techniques. Includes examples and illustrations of the best current practice.

Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design

Автор: Mo Fan, Brayton Robert K.
Название: Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design
ISBN: 1402080409 ISBN-13(EAN): 9781402080401
Издательство: Springer
Цена: 51310 T
Наличие на складе: Нет в наличии.
Описание: Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design discusses new approaches to better timing-closure and manufacturability of DSM Integrated Circuits. The key idea presented is the use of regular circuit and interconnect structures such that area/delay can be predicted with high accuracy. The co-design of structures and algorithms allows great opportunities for achieving better final results, thus closing the gap between IC and CAD designers. The regularities also provide simpler and possibly better manufacturability. In this book we present not only algorithms for solving particular sub-problems but also systematic ways of organizing different algorithms in a flow to solve the design problem as a whole. A timing-driven chip design flow is developed based on the new structures and their design algorithms, which produces faster chips in a shorter time.

Integrated Circuit Packaging, Assembly and Interconnections

Автор: Greig William J.
Название: Integrated Circuit Packaging, Assembly and Interconnections
ISBN: 0387281533 ISBN-13(EAN): 9780387281537
Издательство: Springer
Цена: 71960 T
Наличие на складе: Нет в наличии.
Описание: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC.The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes.Integrated Circuit Packaging, Assembly and Interconnections is an introduction, a review and an update of packaging technologies.

Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation / 16th International Workshop, PATMOS 2006, Montpellier, France, September 13-15, 2006, Proceedings

Автор: Vounckx Johan, Azemard Nadine, Maurine Philippe
Название: Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation / 16th International Workshop, PATMOS 2006, Montpellier, France, September 13-15, 2006, Proceedings
ISBN: 3540390944 ISBN-13(EAN): 9783540390947
Издательство: Springer
Цена: 61590 T
Наличие на складе: Нет в наличии.
Описание: This book constitutes the refereed proceedings of the 16th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2006, held in Montpellier, France, in September 2006. The 41 revised full papers and 23 revised poster papers presented together with 4 key notes and 3 industrial abstracts were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on high-level design, power estimation and modeling memory and register files, low-power digital circuits, busses and interconnects, low-power techniques, applications and SoC design, modeling, digital circuits, and reconfigurable and programmable devices.

Digital Integrated Circuit Design

Автор: Hubert Kaeslin
Название: Digital Integrated Circuit Design
ISBN: 0521882672 ISBN-13(EAN): 9780521882675
Издательство: Cambridge Academ
Цена: 26880 T
Наличие на складе: Поставка под заказ.
Описание: This practical, tool-independent guide to designing digital circuits takes a unique, top-down approach, reflecting the nature of the design process in industry. Starting with architecture design, the book comprehensively explains the why and how of digital circuit design, using the physics designers need to know, and no more. Covering system and component aspects, design verification, VHDL modeling, signal integrity, clocking and more, the scope of the book is uniquely comprehensive. With a focus on CMOS technology, numerous examples - VHDL and Verilog code, architectural concepts, and failure reports - practical guidelines, and design checklists, this engaging textbook for senior undergraduate and graduate courses on digital ICs will prepare students for the realities of real-world circuit design. Practitioners will also find the book valuable for its insights and its practical approach. Instructor only solutions and lecture slides are available at: www.cambridge.org/Kaeslin.

Digital BiCMOS Integrated Circuit Design

Автор: Embabi
Название: Digital BiCMOS Integrated Circuit Design
ISBN: 0792392760 ISBN-13(EAN): 9780792392767
Издательство: Springer
Цена: 92370 T
Наличие на складе: Нет в наличии.
Описание: Devoted entirely to the analysis and design of digital BiCMOS integrated circuits, this book also reviews CMOS and CML integrated circuit design. It introduces the reader to IC process technology: CMOS, bipolar and BiCMOS. It covers the modeling of both the bipolar and MOS devices. It discusses many process/device/circuit design issues.

WIE Analysis and Design of Analog Integrated Circuits, 4th Edition

Автор: Sidney J. Gray
Название: WIE Analysis and Design of Analog Integrated Circuits, 4th Edition
ISBN: 047137752X ISBN-13(EAN): 9780471377528
Издательство: Wiley
Цена: 21680 T
Наличие на складе: Поставка под заказ.
Описание: This fourth edition features coverage of cutting edge topics - more advanced CMOS device electronics to include short-channel effects, weak inversion and impact ionization. In this resourceful book, find: coverage of state-of-the-art IC processes shows how modern integrated circuits are fabricated, including recent issues like heterojunction bipolar transistors, copper interconnect and low permittivity dielectric materials. The comprehensive and unified treatment of bipolar and CMOS circuits helps readers design real-world amplifiers in silicon.

Analysis And Design of Digital Integrated Circuits

Автор: Hodges
Название: Analysis And Design of Digital Integrated Circuits
ISBN: 0071181644 ISBN-13(EAN): 9780071181648
Издательство: McGraw-Hill
Цена: 22290 T
Наличие на складе: Поставка под заказ.


 
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